Gwangjae JEON

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,948,872
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,929,316
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,837,551
- Issue date Dec 5, 2023
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,804,427
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with thick under-bump terminal
- Patent number 11,791,295
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Gwangjae Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor package having redistribution...
- Patent number 11,705,341
- Issue date Jul 18, 2023
- Samsung Electronics Co., Ltd.
- Seokhyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,646,260
- Issue date May 9, 2023
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including substrate with outer insulating layer
- Patent number 11,508,649
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Eungkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution substrate having redistribution pattern including vi...
- Patent number 11,348,864
- Issue date May 31, 2022
- Samsung Electronics Co., Ltd.
- Seokhyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing fan-out wafer level package
- Patent number 11,056,461
- Issue date Jul 6, 2021
- Samsung Electronics Co., Ltd.
- Yeonho Jang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234349
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- GWANGJAE JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240203850
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240136311
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- GWANGJAE JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240096831
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Enbin Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240072006
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- WON IL LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240030119
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- DONGKYU KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230420402
- Publication date Dec 28, 2023
- GWANGJAE JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230207441
- Publication date Jun 29, 2023
- JONGYOUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230141447
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- Wonil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD...
- Publication number 20230025903
- Publication date Jan 26, 2023
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220310496
- Publication date Sep 29, 2022
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220270959
- Publication date Aug 25, 2022
- Samsung Electronics Co., Ltd.
- SEOKHYUN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING SUBSTRATE WITH OUTER INSULATING LAYER
- Publication number 20220084924
- Publication date Mar 17, 2022
- Samsung Electronics Co., Ltd.
- EUNGKYU KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220077066
- Publication date Mar 10, 2022
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220077041
- Publication date Mar 10, 2022
- Samsung Electronics Co., Ltd.
- Gwangjae JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220059444
- Publication date Feb 24, 2022
- Samsung Electronics Co., Ltd.
- JONGYOUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACAKGE
- Publication number 20210398890
- Publication date Dec 23, 2021
- Samsung Electronics Co., Ltd.
- DONGKYU KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20210118788
- Publication date Apr 22, 2021
- Samsung Electronics Co., Ltd.
- SEOKHYUN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210028137
- Publication date Jan 28, 2021
- Samsung Electronics Co., Ltd.
- GWANGJAE JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING FAN-OUT WAFER LEVEL PACKAGE
- Publication number 20210020600
- Publication date Jan 21, 2021
- Samsung Electronics Co., Ltd.
- Yeonho JANG
- H01 - BASIC ELECTRIC ELEMENTS

Gwangjae JEON

Person

Patents Grantslast 30 patents

Semiconductor package and method of fabricating the same

Semiconductor package and method of fabricating the same

Semiconductor package

Semiconductor package

Semiconductor package with thick under-bump terminal

Method of fabricating a semiconductor package having redistribution...

Semiconductor package and method of fabricating the same

Semiconductor package including substrate with outer insulating layer

Redistribution substrate having redistribution pattern including vi...

Method of manufacturing fan-out wafer level package

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

REDISTRIBUTION SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING SUBSTRATE WITH OUTER INSULATING LAYER

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACAKGE

REDISTRIBUTION SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

METHOD OF MANUFACTURING FAN-OUT WAFER LEVEL PACKAGE