GwangTae Kim

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Seoul, KR

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with plated copper posts and me...
- Patent number 9,693,455
- Issue date Jun 27, 2017
- STATS ChipPAC Pte. Ltd.
- Seong Won Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of calibrating warpage testing syst...
- Patent number 9,279,673
- Issue date Mar 8, 2016
- STATS ChipPAC, Ltd.
- WonJun Ko
- G01 - MEASURING TESTING
Information Patent Grant
Dual-sided film-assist molding process
- Patent number 9,076,802
- Issue date Jul 7, 2015
- Stats Chippac Ltd.
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Calibrating Warpage Testing Syst...
- Publication number 20140269810
- Publication date Sep 18, 2014
- STATS ChipPAC, Ltd.
- WonJun Ko
- G01 - MEASURING TESTING