Gye-Soo Kim

Follow

Person

Busan, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Built-up printed circuit board with stack type via-holes
- Patent number 7,705,247
- Issue date Apr 27, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Bong-Suck Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing built-up printed circuit board with stacke...
- Patent number 7,152,318
- Issue date Dec 26, 2006
- Samsung Electro-Mechanics Co., Ltd.
- Bong-Suck Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250167088
- Publication date May 22, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Gye Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Built-up printed circuit board with stack type via-holes
- Publication number 20070039753
- Publication date Feb 22, 2007
- Samsung Electro-Mechanics CO., LTD.
- Bong-Suck Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Built-up printed circuit board with stacked via-holes and method fo...
- Publication number 20040112637
- Publication date Jun 17, 2004
- Samsung Electro-Mechanics CO., LTD.
- Bong-Suck Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR