Gyeong-Min Lee

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Ulsan, KR

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Patents Grantslast 30 patents

Information Patent Grant
Chip through flooring material using PLA resin
- Patent number 9,623,635
- Issue date Apr 18, 2017
- LG Hausys, Ltd.
- Cheng-Zhe Huang
- E04 - BUILDING
Information Patent Grant
Floor material using PLA resin
- Patent number 9,517,612
- Issue date Dec 13, 2016
- LG Hausys, Ltd.
- Cheng-Zhe Huang
- E04 - BUILDING
Information Patent Grant
Chip-inlaid flooring material using PLA resin
- Patent number 9,422,729
- Issue date Aug 23, 2016
- LG Hausys, Ltd.
- Hyun-Jong Kwon
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP-INLAID FLOORING MATERIAL USING PLA RESIN
- Publication number 20130302577
- Publication date Nov 14, 2013
- LG HAUSYS, LTD.
- Hyun-Jong Kwon
- B32 - LAYERED PRODUCTS
Information Patent Application
BOARD COMPLEX HAVING PLA COVER
- Publication number 20130004703
- Publication date Jan 3, 2013
- LG HAUSYS, LTD.
- Hyun-Jong Kwon
- B32 - LAYERED PRODUCTS
Information Patent Application
FLOOR MATERIAL USING PLA RESIN
- Publication number 20130004751
- Publication date Jan 3, 2013
- LG HAUSYS, LTD.
- Cheng-Zhe Huang
- B32 - LAYERED PRODUCTS
Information Patent Application
CHIP THROUGH FLOORING MATERIAL USING PLA RESIN
- Publication number 20120231256
- Publication date Sep 13, 2012
- LG HAUSYS, LTD.
- Cheng-Zhe Huang
- B32 - LAYERED PRODUCTS