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Gyujin CHOI
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Suwon-si, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor package including under bump metallization pad
Patent number
11,990,439
Issue date
May 21, 2024
Samsung Electronics Co., Ltd.
Jaeean Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package device
Patent number
11,978,696
Issue date
May 7, 2024
Samsung Electronics Co., Ltd.
Gyujin Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a semiconductor package including correctin...
Patent number
11,972,966
Issue date
Apr 30, 2024
Samsung Electronics Co., Ltd.
Gyujin Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages having vias
Patent number
11,961,812
Issue date
Apr 16, 2024
Samsung Electronics Co., Ltd.
Changeun Joo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,810,864
Issue date
Nov 7, 2023
Samsung Electronics Co., Ltd.
Changeun Joo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages having vias
Patent number
11,587,898
Issue date
Feb 21, 2023
Samsung Electronics Co., Ltd.
Changeun Joo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
Patent number
11,373,955
Issue date
Jun 28, 2022
Samsung Electronics Co., Ltd.
Changeun Joo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing connection structure of semiconductor chip...
Patent number
11,264,339
Issue date
Mar 1, 2022
Samsung Electronics Co., Ltd.
Gyujin Choi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240063131
Publication date
Feb 22, 2024
Samsung Electronics Co., Ltd.
Jaeean Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES HAVING VIAS
Publication number
20230207508
Publication date
Jun 29, 2023
Samsung Electronics Co., Ltd.
CHANGEUN JOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE DEVICE
Publication number
20220384324
Publication date
Dec 1, 2022
Samsung Electronics Co., Ltd.
Gyujin Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20220328415
Publication date
Oct 13, 2022
Samsung Electronics Co., Ltd.
CHANGEUN JOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD
Publication number
20220165693
Publication date
May 26, 2022
Samsung Electronics Co., Ltd.
Jaeean LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20210265274
Publication date
Aug 26, 2021
Samsung Electronics Co., Ltd.
CHANGEUN JOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
Publication number
20210183677
Publication date
Jun 17, 2021
Samsung Electronics Co., Ltd.
GYUJIN CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES HAVING VIAS
Publication number
20210143118
Publication date
May 13, 2021
Samsung Electronics Co., Ltd.
CHANGEUN JOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING CONNECTION STRUCTURE OF SEMICONDUCTOR CHIP...
Publication number
20200273817
Publication date
Aug 27, 2020
Samsung Electronics Co., Ltd.
Gyujin CHOI
H01 - BASIC ELECTRIC ELEMENTS