Gyujin CHOI

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including under bump metallization pad
- Patent number 11,990,439
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Jaeean Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device
- Patent number 11,978,696
- Issue date May 7, 2024
- Samsung Electronics Co., Ltd.
- Gyujin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package including correctin...
- Patent number 11,972,966
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Gyujin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having vias
- Patent number 11,961,812
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Changeun Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,810,864
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Changeun Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having vias
- Patent number 11,587,898
- Issue date Feb 21, 2023
- Samsung Electronics Co., Ltd.
- Changeun Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,373,955
- Issue date Jun 28, 2022
- Samsung Electronics Co., Ltd.
- Changeun Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing connection structure of semiconductor chip...
- Patent number 11,264,339
- Issue date Mar 1, 2022
- Samsung Electronics Co., Ltd.
- Gyujin Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250022785
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- PYUNGHWA HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED STRUCTURE INCLUDING CONDUCTIVE PATTERN FOR SELF-ALIGNMENT
- Publication number 20240404936
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Gyujin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240387486
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Dahee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240347487
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Jaeean Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240304557
- Publication date Sep 12, 2024
- Samsung Electronics Co., Ltd.
- Gyujin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20240266269
- Publication date Aug 8, 2024
- Samsung Electronics Co., Ltd.
- Gyujin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240063131
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Jaeean Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING VIAS
- Publication number 20230207508
- Publication date Jun 29, 2023
- Samsung Electronics Co., Ltd.
- CHANGEUN JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20220384324
- Publication date Dec 1, 2022
- Samsung Electronics Co., Ltd.
- Gyujin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220328415
- Publication date Oct 13, 2022
- Samsung Electronics Co., Ltd.
- CHANGEUN JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD
- Publication number 20220165693
- Publication date May 26, 2022
- Samsung Electronics Co., Ltd.
- Jaeean LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20210265274
- Publication date Aug 26, 2021
- Samsung Electronics Co., Ltd.
- CHANGEUN JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20210183677
- Publication date Jun 17, 2021
- Samsung Electronics Co., Ltd.
- GYUJIN CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING VIAS
- Publication number 20210143118
- Publication date May 13, 2021
- Samsung Electronics Co., Ltd.
- CHANGEUN JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CONNECTION STRUCTURE OF SEMICONDUCTOR CHIP...
- Publication number 20200273817
- Publication date Aug 27, 2020
- Samsung Electronics Co., Ltd.
- Gyujin CHOI
- H01 - BASIC ELECTRIC ELEMENTS

Gyujin CHOI

Person

Patents Grantslast 30 patents

Semiconductor package including under bump metallization pad

Semiconductor package device

Method of manufacturing a semiconductor package including correctin...

Semiconductor packages having vias

Semiconductor package

Semiconductor packages having vias

Semiconductor package and method of manufacturing the semiconductor...

Method of manufacturing connection structure of semiconductor chip...

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

STACKED STRUCTURE INCLUDING CONDUCTIVE PATTERN FOR SELF-ALIGNMENT

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES HAVING VIAS

SEMICONDUCTOR PACKAGE DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES HAVING VIAS

METHOD OF MANUFACTURING CONNECTION STRUCTURE OF SEMICONDUCTOR CHIP...