Gyung Sik Yun

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Ichon si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package system with overhang film
- Patent number 8,304,898
- Issue date Nov 6, 2012
- Stats Chippac Ltd.
- Hye Ran Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH OVERHANG FILM
- Publication number 20090212419
- Publication date Aug 27, 2009
- Hye Ran Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR IMPLEMENTING HARD-METAL WIRE BONDS
- Publication number 20080272487
- Publication date Nov 6, 2008
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS