Gyung Sik Yun

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Young-in, KR

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with interconnects and method o...
- Patent number 8,609,525
- Issue date Dec 17, 2013
- Stats Chippac Ltd.
- BongHwan Han
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS AND METHOD O...
- Publication number 20120241964
- Publication date Sep 27, 2012
- BongHwan Han
- H01 - BASIC ELECTRIC ELEMENTS