Hadi Jebory

Person

Irvine, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a semiconductor wafer including a through sub...
- Patent number 9,984,888
- Issue date May 29, 2018
- Newport Fab, LLC
- David J. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated through silicon via and isolated deep silicon via having t...
- Patent number 9,673,081
- Issue date Jun 6, 2017
- Newport Fab, LLC
- Hadi Jebory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated through silicon vias in RF technologies
- Patent number 9,577,035
- Issue date Feb 21, 2017
- Newport Fab, LLC
- Paul D. Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anchor vias for improved backside metal adhesion to semiconductor s...
- Patent number 9,245,826
- Issue date Jan 26, 2016
- Newport Fab, LLC
- Hadi Jebory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via structure, method of formation, and integration...
- Patent number 9,147,609
- Issue date Sep 29, 2015
- Newport Fab, LLC
- Hadi Jebory
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method Of Fabricating A Semiconductor Wafer Including A Through Sub...
- Publication number 20180247822
- Publication date Aug 30, 2018
- Newport Fab, LLC dba Jazz Semiconductor, Inc.
- David J. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Wafer Backside Metallization With Improved Backside M...
- Publication number 20160379926
- Publication date Dec 29, 2016
- Newport Fab, LLC dba Jazz Semiconductor, Inc.
- David J. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thinned Processed Wafer Having Devices and Vias and Related Method
- Publication number 20160049355
- Publication date Feb 18, 2016
- NEWPORT FAB, LLC DBA JAZZ SEMICONDUCTOR
- David J. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Anchor Vias for Improved Backside Metal Adhesion to Semiconductor S...
- Publication number 20140252651
- Publication date Sep 11, 2014
- NEWPORT FAB, LLC DBA JAZZ SEMICONDUCTOR
- Hadi Jebory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolated Through Silicon Vias in RF Technologies
- Publication number 20140054743
- Publication date Feb 27, 2014
- NEWPORT FAB, LLC DBA JAZZ SEMICONDUCTOR
- Paul D. Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolated Through Silicon Via and Isolated Deep Silicon Via Having T...
- Publication number 20130313682
- Publication date Nov 28, 2013
- NEWPORT FAB, LLC DBA JAZZ SEMICONDUCTOR
- Hadi Jebory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Silicon Via Structure, Method of Formation, and Integration...
- Publication number 20130087893
- Publication date Apr 11, 2013
- NEWPORT FAB, LLC DBA JAZZ SEMICONDUCTOR
- Hadi Jebory
- H01 - BASIC ELECTRIC ELEMENTS

Hadi Jebory

Person

Patents Grantslast 30 patents

Method of fabricating a semiconductor wafer including a through sub...

Isolated through silicon via and isolated deep silicon via having t...

Isolated through silicon vias in RF technologies

Anchor vias for improved backside metal adhesion to semiconductor s...

Through silicon via structure, method of formation, and integration...

Patents Applicationslast 30 patents

Method Of Fabricating A Semiconductor Wafer Including A Through Sub...

Semiconductor Wafer Backside Metallization With Improved Backside M...

Thinned Processed Wafer Having Devices and Vias and Related Method

Anchor Vias for Improved Backside Metal Adhesion to Semiconductor S...

Isolated Through Silicon Vias in RF Technologies

Isolated Through Silicon Via and Isolated Deep Silicon Via Having T...

Through Silicon Via Structure, Method of Formation, and Integration...