Hae-Jeong Sohn

Person

Kyunggi-Do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip having bond pads
- Patent number 7,825,523
- Issue date Nov 2, 2010
- Samsung Electronics Co., Ltd.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having bond pads and multi-chip package
- Patent number 7,576,440
- Issue date Aug 18, 2009
- Samsung Electronics Co., Ltd.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having bond pads
- Patent number 7,547,977
- Issue date Jun 16, 2009
- Samsung Electronics Co., Ltd.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having bond pads
- Patent number 7,541,682
- Issue date Jun 2, 2009
- Samsung Electronics Co., Ltd.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having bond pads
- Patent number 7,453,159
- Issue date Nov 18, 2008
- Samsung Electronics Co., Ltd.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor multi-chip package
- Patent number 7,148,578
- Issue date Dec 12, 2006
- Samsung Electronics Co., Ltd.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having bond pads and multi-chip package
- Patent number 6,642,627
- Issue date Nov 4, 2003
- Samsung Electronics Co., Ltd.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor chip having bond pads
- Publication number 20070108562
- Publication date May 17, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING BOND PADS
- Publication number 20070108633
- Publication date May 17, 2007
- Samsung Electronics Co., Ltd.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING BOND PADS
- Publication number 20070108632
- Publication date May 17, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING BOND PADS AND MULTI-CHIP PACKAGE
- Publication number 20070057367
- Publication date Mar 15, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING BOND PADS AND MULTI-CHIP PACKAGE
- Publication number 20070057383
- Publication date Mar 15, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip having bond pads and multi-chip package
- Publication number 20040041258
- Publication date Mar 4, 2004
- Samsung Electronic Co., Ltd.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip having bond pads and multi-chip package
- Publication number 20030011068
- Publication date Jan 16, 2003
- Samsung Electronics Co., Ltd.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS

Hae-Jeong Sohn

Person

Patents Grantslast 30 patents

Semiconductor chip having bond pads

Semiconductor chip having bond pads and multi-chip package

Semiconductor chip having bond pads

Semiconductor chip having bond pads

Semiconductor chip having bond pads

Semiconductor multi-chip package

Semiconductor chip having bond pads and multi-chip package

Patents Applicationslast 30 patents

Semiconductor chip having bond pads

SEMICONDUCTOR CHIP HAVING BOND PADS

SEMICONDUCTOR CHIP HAVING BOND PADS

SEMICONDUCTOR CHIP HAVING BOND PADS AND MULTI-CHIP PACKAGE

SEMICONDUCTOR CHIP HAVING BOND PADS AND MULTI-CHIP PACKAGE

Semiconductor chip having bond pads and multi-chip package

Semiconductor chip having bond pads and multi-chip package