Hae-Jung Yu

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices having highly integrated sheet and wire patte...
- Patent number 12,230,630
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Kyung In Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,218,070
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Hae-Jung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,080,796
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Kyung In Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a molding layer
- Patent number 12,080,676
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Hae-Jung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with memory stack structure connected to logi...
- Patent number 11,935,867
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor package
- Patent number 11,637,070
- Issue date Apr 25, 2023
- Samsung Electronics Co., Ltd.
- Hae-Jung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having dummy pads and method of manufacturing...
- Patent number 11,282,792
- Issue date Mar 22, 2022
- Samsung Electronics Co., Ltd.
- Young Kun Jee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 10,854,551
- Issue date Dec 1, 2020
- Samsung Electronics Co., Ltd.
- Hae-Jung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package electronic devices including sealing layers and...
- Patent number 9,245,867
- Issue date Jan 26, 2016
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging apparatus formed from semiconductor package...
- Patent number 9,245,863
- Issue date Jan 26, 2016
- Samsung Electronics Co., Ltd.
- Hae-jung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including a heat spreader and methods of for...
- Patent number 9,054,228
- Issue date Jun 9, 2015
- Samsung Electronics Co., Ltd.
- Eun-Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device including a substrate at...
- Patent number 8,912,048
- Issue date Dec 16, 2014
- Samsung Electronics Co., Ltd.
- Jong-Youn Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package electronic devices including sealing layers and...
- Patent number 8,779,606
- Issue date Jul 15, 2014
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded underfill flip chip package preventing warpage and void
- Patent number 8,592,997
- Issue date Nov 26, 2013
- Samsung Electronics Co., Ltd.
- Hae-jung Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating electronic device having stacked chips
- Patent number 7,923,291
- Issue date Apr 12, 2011
- Samsung Electronics Co., Ltd.
- Hae-Jung Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A MOLDING LAYER
- Publication number 20240404984
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- HAE-JUNG YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240372002
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Kyung In Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER
- Publication number 20240243050
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- HAE-JUNG YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105773
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Hae Jun YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230245975
- Publication date Aug 3, 2023
- Samsung Electronics Co., Ltd.
- Hae-Jung YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230108041
- Publication date Apr 6, 2023
- Samsung Electronics Co., Ltd.
- Hae Jun YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230063147
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- HAE-JUNG YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING HIGHLY INTEGRATED SHEET AND WIRE PATTE...
- Publication number 20220399330
- Publication date Dec 15, 2022
- Samsung Electronics Co., Ltd.
- Kyung In Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A MOLDING LAYER
- Publication number 20220328445
- Publication date Oct 13, 2022
- Samsung Electronics Co., Ltd.
- HAE-JUNG YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220302310
- Publication date Sep 22, 2022
- Samsung Electronics Co., Ltd.
- KYUNG IN CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220189916
- Publication date Jun 16, 2022
- Samsung Electronics Co., Ltd.
- YANGGYOO JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING DUMMY PADS AND METHOD OF MANUFACTURING...
- Publication number 20220173044
- Publication date Jun 2, 2022
- Samsung Electronics Co., Ltd.
- YOUNG KUN JEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
- Publication number 20210082824
- Publication date Mar 18, 2021
- Samsung Electronics Co., Ltd.
- Hae-Jung YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING DUMMY PADS AND METHOD OF MANUFACTURING...
- Publication number 20210005553
- Publication date Jan 7, 2021
- Samsung Electronics Co., Ltd.
- YOUNG KUN JEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20190244905
- Publication date Aug 8, 2019
- Samsung Electronics Co., Ltd.
- Hae-Jung YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING A HEAT SPREADER AND METHODS OF FOR...
- Publication number 20140299980
- Publication date Oct 9, 2014
- Samsung Electronics Co., Ltd.
- Eun-Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ELECTRONIC DEVICES INCLUDING SEALING LAYERS AND...
- Publication number 20140273348
- Publication date Sep 18, 2014
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20140239478
- Publication date Aug 28, 2014
- Samsung Electronics Co., Ltd.
- Ji-Seok HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20140213017
- Publication date Jul 31, 2014
- Samsung Electronics Co., Ltd.
- Jong-Youn KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE APPARATUS
- Publication number 20140091463
- Publication date Apr 3, 2014
- Hae-jung YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ELECTRONIC DEVICES INCLUDING SEALING LAYERS AND...
- Publication number 20130270685
- Publication date Oct 17, 2013
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED UNDERFILL FLIP CHIP PACKAGE PREVENTING WARPAGE AND VOID
- Publication number 20110193228
- Publication date Aug 11, 2011
- Samsung Electronics Co., Ltd.
- Hae-jung Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of fabricating electronic device having stacked chips
- Publication number 20100022051
- Publication date Jan 28, 2010
- SAMSUNG ELECTRONICS CO., LTD.
- Hae-Jung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20080268579
- Publication date Oct 30, 2008
- Samsung Electronics Co., Ltd.
- Hae-Jung YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device stack package, electronic apparatus including...
- Publication number 20080258288
- Publication date Oct 23, 2008
- Samsung Electronics Co., Ltd.
- Jin-woo Park
- H01 - BASIC ELECTRIC ELEMENTS

Hae-Jung Yu

Person

Patents Grantslast 30 patents

Semiconductor devices having highly integrated sheet and wire patte...

Semiconductor package and method of fabricating the same

Semiconductor device

Semiconductor package including a molding layer

Semiconductor package with memory stack structure connected to logi...

Method of fabricating a semiconductor package

Semiconductor package having dummy pads and method of manufacturing...

Semiconductor package and method of fabricating the same

Package-on-package electronic devices including sealing layers and...

Semiconductor packaging apparatus formed from semiconductor package...

Semiconductor packages including a heat spreader and methods of for...

Method of fabricating semiconductor device including a substrate at...

Package-on-package electronic devices including sealing layers and...

Molded underfill flip chip package preventing warpage and void

Method of fabricating electronic device having stacked chips

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING A MOLDING LAYER

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICES HAVING HIGHLY INTEGRATED SHEET AND WIRE PATTE...

SEMICONDUCTOR PACKAGE INCLUDING A MOLDING LAYER

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE HAVING DUMMY PADS AND METHOD OF MANUFACTURING...

METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE HAVING DUMMY PADS AND METHOD OF MANUFACTURING...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGES INCLUDING A HEAT SPREADER AND METHODS OF FOR...

PACKAGE-ON-PACKAGE ELECTRONIC DEVICES INCLUDING SEALING LAYERS AND...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHOD OF FABRICATING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE APPARATUS

PACKAGE-ON-PACKAGE ELECTRONIC DEVICES INCLUDING SEALING LAYERS AND...

MOLDED UNDERFILL FLIP CHIP PACKAGE PREVENTING WARPAGE AND VOID

Method of fabricating electronic device having stacked chips

SEMICONDUCTOR CHIP PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor device stack package, electronic apparatus including...