Haengcheol Choi

Person

Kyonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of integrating RF antenna interpose...
- Patent number 12,100,663
- Issue date Sep 24, 2024
- STATS ChipPAC Pte. Ltd.
- NamJu Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of integrating RF antenna interpose...
- Patent number 11,735,530
- Issue date Aug 22, 2023
- STATS ChipPAC Pte. Ltd.
- NamJu Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with substrate mold gate and me...
- Patent number 8,859,342
- Issue date Oct 14, 2014
- Stats Chippac Ltd.
- Oh Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system with expansion feature
- Patent number 8,703,541
- Issue date Apr 22, 2014
- Stats Chippac Ltd.
- Haengcheol Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic system with expansion feature
- Patent number 8,178,392
- Issue date May 15, 2012
- Stats Chippac Ltd.
- Haengcheol Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit mount system with solder mask pad
- Patent number 8,124,520
- Issue date Feb 28, 2012
- Stats Chippac Ltd.
- KyungOe Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Integrating RF Antenna Interpose...
- Publication number 20230343720
- Publication date Oct 26, 2023
- STATS ChipPAC Pte Ltd.
- NamJu Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming RDL Hybrid Interposer Su...
- Publication number 20230119181
- Publication date Apr 20, 2023
- STATS ChipPAC Pte Ltd.
- JongTae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Integrating RF Antenna Interpose...
- Publication number 20230067475
- Publication date Mar 2, 2023
- STATS ChipPAC Pte Ltd.
- NamJu Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUBSTRATE MOLD GATE AND ME...
- Publication number 20130154079
- Publication date Jun 20, 2013
- Oh Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM WITH EXPANSION FEATURE
- Publication number 20120193132
- Publication date Aug 2, 2012
- Haengcheol Choi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC SYSTEM WITH EXPANSION FEATURE
- Publication number 20080283998
- Publication date Nov 20, 2008
- Haengcheol Choi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
INTEGRATED CIRCUIT MOUNT SYSTEM WITH SOLDER MASK PAD
- Publication number 20080014738
- Publication date Jan 17, 2008
- STATS ChipPAC Ltd.
- KyungOe Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SPACERLESS SEMICONDUCTOR PACKAGE CHIP STACKING SYSTEM
- Publication number 20070268660
- Publication date Nov 22, 2007
- STATS ChipPAC Ltd.
- Seungyun Ahn
- H01 - BASIC ELECTRIC ELEMENTS

Haengcheol Choi

Person

Patents Grantslast 30 patents

Semiconductor device and method of integrating RF antenna interpose...

Semiconductor device and method of integrating RF antenna interpose...

Integrated circuit packaging system with substrate mold gate and me...

Electronic system with expansion feature

Electronic system with expansion feature

Integrated circuit mount system with solder mask pad

Patents Applicationslast 30 patents

Semiconductor Device and Method of Integrating RF Antenna Interpose...

Semiconductor Device and Method of Forming RDL Hybrid Interposer Su...

Semiconductor Device and Method of Integrating RF Antenna Interpose...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUBSTRATE MOLD GATE AND ME...

ELECTRONIC SYSTEM WITH EXPANSION FEATURE

ELECTRONIC SYSTEM WITH EXPANSION FEATURE

INTEGRATED CIRCUIT MOUNT SYSTEM WITH SOLDER MASK PAD

SPACERLESS SEMICONDUCTOR PACKAGE CHIP STACKING SYSTEM