Hai-Hung Wen

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Hsinchu County, TW

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Patents Grantslast 30 patents

Information Patent Grant
Covering structure, sound producing package and related manufacturi...
- Patent number 11,917,348
- Issue date Feb 27, 2024
- XMEMS TAIWAN CO., LTD.
- Hai-Hung Wen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Sound producing package structure and method for packaging sound pr...
- Patent number 11,395,073
- Issue date Jul 19, 2022
- xMEMS Labs, Inc.
- Hai-Hung Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure and methods of manufacturing sound producing chip...
- Patent number 11,252,511
- Issue date Feb 15, 2022
- xMEMS Labs, Inc.
- Chiung C. Lo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE, APPARATUS AND FORMING METHODS THEREOF
- Publication number 20240022859
- Publication date Jan 18, 2024
- xMEMS Labs, Inc.
- Chiung C. Lo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Covering structure, sound producing package and related manufacturi...
- Publication number 20220386000
- Publication date Dec 1, 2022
- XMEMS TAIWAN CO., LTD.
- Hai-Hung Wen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SOUND PRODUCING PACKAGE STRUCTURE AND METHOD FOR PACKAGING SOUND PR...
- Publication number 20210329386
- Publication date Oct 21, 2021
- xMEMS Labs, Inc.
- Hai-Hung Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE AND METHODS OF MANUFACTURING SOUND PRODUCING CHIP...
- Publication number 20210297787
- Publication date Sep 23, 2021
- xMEMS Labs, Inc.
- Chiung C. Lo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE