Hai Jeong Sohn

Person

Suwon, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Stack semiconductor chip package and lead frame
- Patent number 6,724,074
- Issue date Apr 20, 2004
- Samsung Electronics Co., Ltd.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-lead type square semiconductor package and dual in-line memory...
- Patent number 6,573,611
- Issue date Jun 3, 2003
- Samsung Electronics Co., Ltd.
- Hai Jeong Sohn
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for manufacturing a chip scale package having copper traces...
- Patent number 6,319,828
- Issue date Nov 20, 2001
- Samsung Electronics Co., Ltd.
- Do Soo Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number D432097
- Issue date Oct 17, 2000
- Samsung Electronics Co., Ltd.
- Young-Hee Song
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Semiconductor module
- Patent number D432096
- Issue date Oct 17, 2000
- Samsung Electronics Co., Ltd.
- Jun-Young Jeon
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Lead-on-chip semiconductor package and method for making the same
- Patent number 5,933,708
- Issue date Aug 3, 1999
- SamSung Electronics, Co., Ltd.
- Sung Min Sim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frames including extended tie-bars, and semiconductor chip pac...
- Patent number 5,811,875
- Issue date Sep 22, 1998
- Samsung Electronics Co., Ltd.
- Do Soo Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Down-bonded lead-on-chip type semiconductor device
- Patent number 5,428,247
- Issue date Jun 27, 1995
- SamSung Electronics Co., Ltd.
- Hai-jeong Sohn
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Stack semiconductor chip package and lead frame
- Publication number 20030122239
- Publication date Jul 3, 2003
- Samsung Electronics, Co., Ltd.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a chip scale package
- Publication number 20020048951
- Publication date Apr 25, 2002
- Do Soo Jeong
- H01 - BASIC ELECTRIC ELEMENTS

Hai Jeong Sohn

Person

Patents Grantslast 30 patents

Stack semiconductor chip package and lead frame

Dual-lead type square semiconductor package and dual in-line memory...

Method for manufacturing a chip scale package having copper traces...

Semiconductor package

Semiconductor module

Lead-on-chip semiconductor package and method for making the same

Lead frames including extended tie-bars, and semiconductor chip pac...

Down-bonded lead-on-chip type semiconductor device

Patents Applicationslast 30 patents

Stack semiconductor chip package and lead frame

Method for manufacturing a chip scale package