Hai LIU

Follow

Person

Suzhou City, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of manufacturing printed circuit board and semiconductor pa...
- Patent number 10,049,970
- Issue date Aug 14, 2018
- Samsung Electronics Co., Ltd.
- Hai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board for semiconductor package
- Patent number 9,504,152
- Issue date Nov 22, 2016
- Samsung Electronics Co., Ltd.
- Hai Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF MANUFACTURING PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PA...
- Publication number 20160372408
- Publication date Dec 22, 2016
- Samsung Electronics Co., Ltd.
- Hai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE
- Publication number 20160005683
- Publication date Jan 7, 2016
- Samsung Electronics Co., Ltd.
- Hai LIU
- H01 - BASIC ELECTRIC ELEMENTS