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Shanghai, CN
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last 30 patents
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Patent Grant
Integrated capacitors in package-level structures, processes of mak...
Patent number
7,989,916
Issue date
Aug 2, 2011
Intel Corporation
John J. Tang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated capacitors in package-level structures, processes of mak...
Patent number
7,670,919
Issue date
Mar 2, 2010
Intel Corporation
John J. Tang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circular wire-bond pad, package made therewith, and method of assem...
Patent number
7,250,684
Issue date
Jul 31, 2007
Intel Corporation
Robert Nickerson
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Integrated capacitors in package-level structures, processes of mak...
Publication number
20100059858
Publication date
Mar 11, 2010
John J. Tang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCULAR WIRE-BOND PAD, PACKAGE MADE THEREWITH, AND METHOD OF ASSEM...
Publication number
20080014436
Publication date
Jan 17, 2008
Intel Corporation
Robert Nickerson
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Integrated capacitors in package-level structures, processes of mak...
Publication number
20070158818
Publication date
Jul 12, 2007
John J. Tang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multiprocessor system
Publication number
20070079041
Publication date
Apr 5, 2007
TYAN COMPUTER CORP.
Shan-Kai Yang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Multiprocessor system
Publication number
20070079046
Publication date
Apr 5, 2007
TYAN COMPUTER CORP.
Shan-Kai Yang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Circular wire-bond pad, package made therewith, and method of assem...
Publication number
20060000876
Publication date
Jan 5, 2006
Robert Nickerson
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR