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Hai-Ming Zhang

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  • Shanghai, CN
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    COMPENSATION METHOD FOR OVERLAY DEVIATION
    • Publication number 20220066329
    • Publication date Mar 3, 2022
    • Semiconductor Manufacturing South China Corporation
    • Hai ZHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
    • Publication number 20210020447
    • Publication date Jan 21, 2021
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Hai Yang ZHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20200111899
    • Publication date Apr 9, 2020
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Hai Yang ZHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURES
    • Publication number 20190148157
    • Publication date May 16, 2019
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Cheng Long ZHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS
    • Publication number 20190074228
    • Publication date Mar 7, 2019
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Hai Yang ZHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURES AND FABRICATION METHODS THEREOF
    • Publication number 20190067008
    • Publication date Feb 28, 2019
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Zhuo Fan CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
    • Publication number 20190057876
    • Publication date Feb 21, 2019
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Hai Yang ZHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
    • Publication number 20180351001
    • Publication date Dec 6, 2018
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Hai Yang ZHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
    • Publication number 20180323289
    • Publication date Nov 8, 2018
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Hai Yang ZHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
    • Publication number 20180315643
    • Publication date Nov 1, 2018
    • Semiconductor Manufaturing International (Shanghai) Corporation
    • Fang Yuan XIAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FINFET DEVICE
    • Publication number 20180294262
    • Publication date Oct 11, 2018
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • CHENG LONG ZHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
    • Publication number 20180294231
    • Publication date Oct 11, 2018
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Hai Yang ZHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IMAGE SENSORS, AND FABRICATION AND OPERATION METHODS THEREOF
    • Publication number 20180277586
    • Publication date Sep 27, 2018
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Guo Feng YAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURES AND FABRICATION METHODS THEREOF
    • Publication number 20180261515
    • Publication date Sep 13, 2018
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Yan WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURES AND FABRICATION METHODS THEREOF
    • Publication number 20180204731
    • Publication date Jul 19, 2018
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Cheng Long ZHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
    • Publication number 20180158724
    • Publication date Jun 7, 2018
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Rong Yao CHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PHOTOMASK MANUFACTURING METHOD
    • Publication number 20180144947
    • Publication date May 24, 2018
    • Semiconductor Manufacturing International (Beijing) Corporation
    • Hai Yang ZHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FIN CUT PROCESS AND FIN STRUCTURE
    • Publication number 20180144986
    • Publication date May 24, 2018
    • Semiconductor Manufacturing International (Beijing) Corporation
    • HAI YANG ZHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
    • Publication number 20180061830
    • Publication date Mar 1, 2018
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Yan WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
    • Publication number 20180047632
    • Publication date Feb 15, 2018
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Cheng Long ZHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR FORMING FINFET DEVICE
    • Publication number 20170352658
    • Publication date Dec 7, 2017
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • CHENG LONG ZHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
    • Publication number 20170294535
    • Publication date Oct 12, 2017
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Cheng Long ZHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ETCHING METHOD AND FABRICATION METHOD OF SEMICONDUCTOR STRUCTURES
    • Publication number 20170294343
    • Publication date Oct 12, 2017
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Min Da HU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGING STRUCTURE AND PACKAGING METHOD THEREOF
    • Publication number 20170271306
    • Publication date Sep 21, 2017
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Chong WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND RELATED MANUFACTURING METHOD
    • Publication number 20170200808
    • Publication date Jul 13, 2017
    • Semiconductor Manufacturing International (Beijing) Corporation
    • Hai Yang ZHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Plug Connector And Electrical Connector Assembly
    • Publication number 20150147900
    • Publication date May 28, 2015
    • Tyco Electronics Corporation
    • Hai-Jun Zhang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method for arranging mandarin phonetic symbols on a keypad
    • Publication number 20030231120
    • Publication date Dec 18, 2003
    • Hai-Ming Zhang
    • G06 - COMPUTING CALCULATING COUNTING