HAI SAN TEW

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PENANG PULAU PINANG, MY

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Patents Grantslast 30 patents

Information Patent Grant
Single layer integrated circuit package
- Patent number 10,553,475
- Issue date Feb 4, 2020
- QDOS FLEXCIRCUITS SDN BHD
- Zalina Binti Abdullah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit substrate and method of producing thereof
- Patent number 10,461,004
- Issue date Oct 29, 2019
- QDOS FLEXCIRCUITS SDN BHD
- Zalina Binti Abdullah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having pin up interconnect
- Patent number 10,049,935
- Issue date Aug 14, 2018
- QDOS FLEXCIRCUITS SDN BHD
- Zalina Binti Abdullah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for depositing an object onto a wiring board
- Patent number 9,609,759
- Issue date Mar 28, 2017
- QDOS FLEXCIRCUITS SDN BHD
- Hai San Tew
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING PIN-UP INTERCONNECT
- Publication number 20190006239
- Publication date Jan 3, 2019
- QDOS Flexcircuits Sdn Bhd
- Zalina Binti Abdullah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SUBSTRATE AND METHOD OF PRODUCING THEREOF
- Publication number 20180151462
- Publication date May 31, 2018
- QDOS Flexcircuits Sdn Bhd
- ZALINA BINTI ABDULLAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR DEPOSITING AN OBJECT ONTO A WIRING BOARD
- Publication number 20140138027
- Publication date May 22, 2014
- HAI SAN TEW
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL