Hai Sin Chong

Follow

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Molded semiconductor package with C-wing and gull-wing leads
- Patent number 10,325,837
- Issue date Jun 18, 2019
- Infineon Technologies AG
- Cher Hau Danny Koh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Molded Semiconductor Package with C-Wing and Gull-Wing Leads
- Publication number 20190139869
- Publication date May 9, 2019
- INFINEON TECHNOLOGIES AG
- Cher Hau Danny Koh
- H01 - BASIC ELECTRIC ELEMENTS