Haibo Fan

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Hong Kong, HK

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method with clip arrangement in IC package
- Patent number 10,825,757
- Issue date Nov 3, 2020
- Nexperia B.V.
- Haibo Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,658,274
- Issue date May 19, 2020
- Nexperia B.V.
- Tim Boettcher
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...
- Publication number 20240096769
- Publication date Mar 21, 2024
- NEXPERIA B.V.
- Haibo Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20190189545
- Publication date Jun 20, 2019
- NEXPERIA B.V.
- Tim BOETTCHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD WITH CLIP ARRANGEMENT IN IC PACKAGE
- Publication number 20180174951
- Publication date Jun 21, 2018
- Nexperia B.V.
- Haibo Fan
- H01 - BASIC ELECTRIC ELEMENTS