Haidong Liu

Person

Wuxi, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Thick-film conductive paste, and their use in the manufacture of so...
- Patent number 11,508,862
- Issue date Nov 22, 2022
- Changzhou Fusion New Material Co., Ltd.
- Kuninori Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for wafer-level chip scale package testing
- Patent number 9,676,619
- Issue date Jun 13, 2017
- MEMSIC SEMICONDUCTOR (WUXI) CO., LTD.
- Yang Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Magnetometer
- Patent number 8,525,514
- Issue date Sep 3, 2013
- Memsic, Inc.
- Yongyao Cai
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Magnetic sensor for use with hand-held devices
- Patent number 8,139,030
- Issue date Mar 20, 2012
- Memsic, Inc.
- Yang Zhao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multi-temperature programming for accelerometer
- Patent number 7,461,535
- Issue date Dec 9, 2008
- Memsic, Inc.
- Feiming Huang
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
THICK-FILM CONDUCTIVE PASTE, AND THEIR USE IN THE MANUFACTURE OF SO...
- Publication number 20210057596
- Publication date Feb 25, 2021
- Changzhou Fusion New Material Co., Ltd.
- Kuninori OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Wafer-Level Chip Scale Package Testing
- Publication number 20170113929
- Publication date Apr 27, 2017
- Memsic Semiconductor (Wuxi) Co., Ltd.
- Yang Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FOLDABLE SUBSTRATE
- Publication number 20130249542
- Publication date Sep 26, 2013
- Yang Zhao
- B32 - LAYERED PRODUCTS
Information Patent Application
SENSOR PACKAGE HAVING INTEGRATED ACCELEROMETER AND MAGNETOMETER
- Publication number 20120255357
- Publication date Oct 11, 2012
- Dongmin Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGHLY SENSITIVE CAPACITIVE SENSOR AND METHODS OF MANUFACTURING THE...
- Publication number 20120048019
- Publication date Mar 1, 2012
- Hanqin Zhou
- G01 - MEASURING TESTING
Information Patent Application
MAGNETOMETER
- Publication number 20110227569
- Publication date Sep 22, 2011
- Yongyao Cai
- G01 - MEASURING TESTING
Information Patent Application
MAGNETIC SENSOR FOR USE WITH HAND-HELD DEVICES
- Publication number 20100161084
- Publication date Jun 24, 2010
- Yang Zhao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Multi-temperature programming for accelerometer
- Publication number 20070204672
- Publication date Sep 6, 2007
- Feiming Huang
- G01 - MEASURING TESTING

Haidong Liu

Person

Patents Grantslast 30 patents

Thick-film conductive paste, and their use in the manufacture of so...

Method for wafer-level chip scale package testing

Magnetometer

Magnetic sensor for use with hand-held devices

Multi-temperature programming for accelerometer

Patents Applicationslast 30 patents

THICK-FILM CONDUCTIVE PASTE, AND THEIR USE IN THE MANUFACTURE OF SO...

Method For Wafer-Level Chip Scale Package Testing

FOLDABLE SUBSTRATE

SENSOR PACKAGE HAVING INTEGRATED ACCELEROMETER AND MAGNETOMETER

HIGHLY SENSITIVE CAPACITIVE SENSOR AND METHODS OF MANUFACTURING THE...

MAGNETOMETER

MAGNETIC SENSOR FOR USE WITH HAND-HELD DEVICES

Multi-temperature programming for accelerometer