HAIFA HARIRI

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate patch reconstitution options
- Patent number 11,552,019
- Issue date Jan 10, 2023
- Intel Corporation
- Haifa Hariri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally coupled package-on-package semiconductor packages
- Patent number 11,222,877
- Issue date Jan 11, 2022
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTROLYTIC SURFACE FINISH ARCHITECTURE
- Publication number 20240105575
- Publication date Mar 28, 2024
- Intel Corporation
- Jason M. GAMBA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE HAVING ONE OR MORE ELECTRICAL INTERCONNECTS
- Publication number 20240006298
- Publication date Jan 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STEPPED COAX MIL PTHS FOR MODULATING INDUCTANCE WITHIN A PACKAGE
- Publication number 20220102055
- Publication date Mar 31, 2022
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC CORE INDUCTORS IN INTERPOSER
- Publication number 20220093536
- Publication date Mar 24, 2022
- Intel Corporation
- Krishna BHARATH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE LAND PAD IN CLOSED-LOOP TRACE FOR HIGH SPEED DATA SIGNALING
- Publication number 20210305138
- Publication date Sep 30, 2021
- Intel Corporation
- Zhichao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-PLANE INDUCTORS IN IC PACKAGES
- Publication number 20210273036
- Publication date Sep 2, 2021
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PATCH RECONSTITUTION OPTIONS
- Publication number 20200294920
- Publication date Sep 17, 2020
- Intel Corporation
- Haifa HARIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY COUPLED PACKAGE-ON-PACKAGE SEMICONDUCTOR
- Publication number 20190103385
- Publication date Apr 4, 2019
- Intel Corporation
- OMKAR KARHADE
- H01 - BASIC ELECTRIC ELEMENTS

HAIFA HARIRI

Person

Patents Grantslast 30 patents

Substrate patch reconstitution options

Thermally coupled package-on-package semiconductor packages

Patents Applicationslast 30 patents

ELECTROLYTIC SURFACE FINISH ARCHITECTURE

SUBSTRATE HAVING ONE OR MORE ELECTRICAL INTERCONNECTS

STEPPED COAX MIL PTHS FOR MODULATING INDUCTANCE WITHIN A PACKAGE

MAGNETIC CORE INDUCTORS IN INTERPOSER

PACKAGE LAND PAD IN CLOSED-LOOP TRACE FOR HIGH SPEED DATA SIGNALING

IN-PLANE INDUCTORS IN IC PACKAGES

SUBSTRATE PATCH RECONSTITUTION OPTIONS

THERMALLY COUPLED PACKAGE-ON-PACKAGE SEMICONDUCTOR