HAIFA HARIRI

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
In-plane inductors in IC packages
- Patent number 12,336,197
- Issue date Jun 17, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic core inductors in interposer
- Patent number 12,224,252
- Issue date Feb 11, 2025
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate patch reconstitution options
- Patent number 11,552,019
- Issue date Jan 10, 2023
- Intel Corporation
- Haifa Hariri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally coupled package-on-package semiconductor packages
- Patent number 11,222,877
- Issue date Jan 11, 2022
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...
- Publication number 20250183182
- Publication date Jun 5, 2025
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Publication number 20250126814
- Publication date Apr 17, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Publication number 20250125201
- Publication date Apr 17, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Publication number 20250125202
- Publication date Apr 17, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Publication number 20250120102
- Publication date Apr 10, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDU...
- Publication number 20250113434
- Publication date Apr 3, 2025
- Intel Corporation
- Bai NIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTIC SURFACE FINISH ARCHITECTURE
- Publication number 20240105575
- Publication date Mar 28, 2024
- Intel Corporation
- Jason M. GAMBA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE HAVING ONE OR MORE ELECTRICAL INTERCONNECTS
- Publication number 20240006298
- Publication date Jan 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STEPPED COAX MIL PTHS FOR MODULATING INDUCTANCE WITHIN A PACKAGE
- Publication number 20220102055
- Publication date Mar 31, 2022
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC CORE INDUCTORS IN INTERPOSER
- Publication number 20220093536
- Publication date Mar 24, 2022
- Intel Corporation
- Krishna BHARATH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE LAND PAD IN CLOSED-LOOP TRACE FOR HIGH SPEED DATA SIGNALING
- Publication number 20210305138
- Publication date Sep 30, 2021
- Intel Corporation
- Zhichao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-PLANE INDUCTORS IN IC PACKAGES
- Publication number 20210273036
- Publication date Sep 2, 2021
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PATCH RECONSTITUTION OPTIONS
- Publication number 20200294920
- Publication date Sep 17, 2020
- Intel Corporation
- Haifa HARIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY COUPLED PACKAGE-ON-PACKAGE SEMICONDUCTOR
- Publication number 20190103385
- Publication date Apr 4, 2019
- Intel Corporation
- OMKAR KARHADE
- H01 - BASIC ELECTRIC ELEMENTS

HAIFA HARIRI

Person

Patents Grantslast 30 patents

In-plane inductors in IC packages

Magnetic core inductors in interposer

Substrate patch reconstitution options

Thermally coupled package-on-package semiconductor packages

Patents Applicationslast 30 patents

MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDU...

ELECTROLYTIC SURFACE FINISH ARCHITECTURE

SUBSTRATE HAVING ONE OR MORE ELECTRICAL INTERCONNECTS

STEPPED COAX MIL PTHS FOR MODULATING INDUCTANCE WITHIN A PACKAGE

MAGNETIC CORE INDUCTORS IN INTERPOSER

PACKAGE LAND PAD IN CLOSED-LOOP TRACE FOR HIGH SPEED DATA SIGNALING

IN-PLANE INDUCTORS IN IC PACKAGES

SUBSTRATE PATCH RECONSTITUTION OPTIONS

THERMALLY COUPLED PACKAGE-ON-PACKAGE SEMICONDUCTOR