Haiguang Chen

Person

Millbrae, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and systems for monitoring a parameter of a measurement dev...
- Patent number 8,831,767
- Issue date Sep 9, 2014
- KLA-Tencor Technologies Corp.
- Kurt Lehman
- B24 - GRINDING POLISHING
Information Patent Grant
Methods and systems for monitoring a parameter of a measurement dev...
- Patent number 8,010,222
- Issue date Aug 30, 2011
- KLA-Tencor Technologies Corp.
- Kurt Lehman
- B24 - GRINDING POLISHING
Information Patent Grant
Methods and systems for detection of selected defects particularly...
- Patent number 7,711,521
- Issue date May 4, 2010
- KLA-Tencor Technologies Corp.
- Sean Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods and systems for detection of selected defects particularly...
- Patent number 7,373,277
- Issue date May 13, 2008
- KLA-Tencor Technologies Corp.
- Sean Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods and systems for monitoring a parameter of a measurement dev...
- Patent number 7,332,438
- Issue date Feb 19, 2008
- KLA-Tencor Technologies Corp.
- Kurt Lehman
- B24 - GRINDING POLISHING
Information Patent Grant
Methods and systems for determining a characteristic of polishing w...
- Patent number 7,175,503
- Issue date Feb 13, 2007
- KLA-Tencor Technologies Corp.
- Kurt Lehman
- B24 - GRINDING POLISHING
Information Patent Grant
Methods and systems for detecting a presence of blobs on a specimen...
- Patent number 7,052,369
- Issue date May 30, 2006
- KLA-Tencor Technologies Corp.
- Kurt Lehman
- B24 - GRINDING POLISHING
Information Patent Grant
Methods and systems for monitoring a parameter of a measurement dev...
- Patent number 7,030,018
- Issue date Apr 18, 2006
- KLA-Tencor Technologies Corp.
- Kurt Lehman
- B24 - GRINDING POLISHING
Information Patent Grant
Methods and systems for generating a two-dimensional map of a chara...
- Patent number 6,935,922
- Issue date Aug 30, 2005
- KLA-Tencor Technologies Corp.
- Kurt Lehman
- B24 - GRINDING POLISHING
Information Patent Grant
Systems and methods for characterizing a polishing process
- Patent number 6,884,146
- Issue date Apr 26, 2005
- KLA-Tencor Technologies Corp.
- Kurt Lehman
- B24 - GRINDING POLISHING
Information Patent Grant
Windows configurable to be coupled to a process tool or to be dispo...
- Patent number 6,866,559
- Issue date Mar 15, 2005
- KLA Tencor Technologies
- Kurt Lehman
- B24 - GRINDING POLISHING
Information Patent Grant
In-situ end point detection for semiconductor wafer polishing
- Patent number 6,514,775
- Issue date Feb 4, 2003
- KLA-Tencor Technologies Corporation
- Haiguang Chen
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND SYSTEMS FOR MONITORING A PARAMETER OF A MEASUREMENT DEV...
- Publication number 20110313558
- Publication date Dec 22, 2011
- KLA-Tencor Technologies Corporation
- Kurt Lehman
- B24 - GRINDING POLISHING
Information Patent Application
METHODS AND SYSTEMS FOR MONITORING A PARAMETER OF A MEASUREMENT DEV...
- Publication number 20080207089
- Publication date Aug 28, 2008
- Kurt Lehman
- B24 - GRINDING POLISHING
Information Patent Application
Methods and systems for detecting a presence of blobs on a specimen...
- Publication number 20060148383
- Publication date Jul 6, 2006
- KLA-Tencor Technologies.
- Kurt Lehman
- B24 - GRINDING POLISHING
Information Patent Application
Methods and systems for monitoring a parameter of a measurement dev...
- Publication number 20060131273
- Publication date Jun 22, 2006
- KLA-Tencor Technologies Corp.
- Kurt Lehman
- B24 - GRINDING POLISHING
Information Patent Application
Methods and systems for detecting a presence of blobs on a specimen...
- Publication number 20030190864
- Publication date Oct 9, 2003
- Kurt Lehman
- B24 - GRINDING POLISHING
Information Patent Application
Methods and systems for determining a characteristic of polishing w...
- Publication number 20030181138
- Publication date Sep 25, 2003
- Kurt Lehman
- B24 - GRINDING POLISHING
Information Patent Application
Methods and systems for monitoring a parameter of a measurement dev...
- Publication number 20030180973
- Publication date Sep 25, 2003
- Kurt Lehman
- B24 - GRINDING POLISHING
Information Patent Application
Systems and methods for characterizing a polishing process
- Publication number 20030181131
- Publication date Sep 25, 2003
- Kurt Lehman
- B24 - GRINDING POLISHING
Information Patent Application
Methods and systems for generating a two-dimensional map of a chara...
- Publication number 20030181132
- Publication date Sep 25, 2003
- Kurt Lehman
- B24 - GRINDING POLISHING
Information Patent Application
Windows configurable to be coupled to a process tool or to be dispo...
- Publication number 20030181139
- Publication date Sep 25, 2003
- Kurt Lehman
- B24 - GRINDING POLISHING
Information Patent Application
IN-SITU END POINT DETECTION FOR SEMICONDUCTOR WAFER POLISHING
- Publication number 20030003605
- Publication date Jan 2, 2003
- KLA-TENCOR
- Haiguang Chen
- B24 - GRINDING POLISHING

Haiguang Chen

Person

Patents Grantslast 30 patents

Methods and systems for monitoring a parameter of a measurement dev...

Methods and systems for monitoring a parameter of a measurement dev...

Methods and systems for detection of selected defects particularly...

Methods and systems for detection of selected defects particularly...

Methods and systems for monitoring a parameter of a measurement dev...

Methods and systems for determining a characteristic of polishing w...

Methods and systems for detecting a presence of blobs on a specimen...

Methods and systems for monitoring a parameter of a measurement dev...

Methods and systems for generating a two-dimensional map of a chara...

Systems and methods for characterizing a polishing process

Windows configurable to be coupled to a process tool or to be dispo...

In-situ end point detection for semiconductor wafer polishing

Patents Applicationslast 30 patents

METHODS AND SYSTEMS FOR MONITORING A PARAMETER OF A MEASUREMENT DEV...

METHODS AND SYSTEMS FOR MONITORING A PARAMETER OF A MEASUREMENT DEV...

Methods and systems for detecting a presence of blobs on a specimen...

Methods and systems for monitoring a parameter of a measurement dev...

Methods and systems for detecting a presence of blobs on a specimen...

Methods and systems for determining a characteristic of polishing w...

Methods and systems for monitoring a parameter of a measurement dev...

Systems and methods for characterizing a polishing process

Methods and systems for generating a two-dimensional map of a chara...

Windows configurable to be coupled to a process tool or to be dispo...

IN-SITU END POINT DETECTION FOR SEMICONDUCTOR WAFER POLISHING