Haiguang Chen

Person

Mountain View, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Process-induced distortion prediction and feedforward and feedback...
- Patent number 10,401,279
- Issue date Sep 3, 2019
- KLA-Tencor Corporation
- Pradeep Vukkadala
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems, methods and metrics for wafer high order shape characteriz...
- Patent number 10,379,061
- Issue date Aug 13, 2019
- KLA-Tencor Corporation
- Haiguang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for wafer structure uniformity monitoring using...
- Patent number 10,352,691
- Issue date Jul 16, 2019
- KLA-Tencor Corporation
- Haiguang Chen
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for wafer surface feature detection, classifica...
- Patent number 10,330,608
- Issue date Jun 25, 2019
- KLA-Tencor Corporation
- Haiguang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and method to emulate finite element model based prediction...
- Patent number 10,025,894
- Issue date Jul 17, 2018
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for effective pattern wafer surface measurement...
- Patent number 9,865,047
- Issue date Jan 9, 2018
- KLA-Tencor Corporation
- Haiguang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for wafer surface feature detection and quantif...
- Patent number 9,702,829
- Issue date Jul 11, 2017
- KLA-Tencor Corporation
- Haiguang Chen
- G01 - MEASURING TESTING
Information Patent Grant
Detection of selected defects in relatively noisy inspection data
- Patent number 9,646,379
- Issue date May 9, 2017
- KLA-Tencor Corp.
- Haiguang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid phase unwrapping systems and methods for patterned wafer mea...
- Patent number 9,632,038
- Issue date Apr 25, 2017
- KLA-Tencor Corporation
- Haiguang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems, methods and metrics for wafer high order shape characteriz...
- Patent number 9,546,862
- Issue date Jan 17, 2017
- KLA-Tencor Corporation
- Haiguang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and method to emulate finite element model based prediction...
- Patent number 9,430,593
- Issue date Aug 30, 2016
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Detection of selected defects in relatively noisy inspection data
- Patent number 9,355,440
- Issue date May 31, 2016
- KLA-Tencor Corp.
- Haiguang Chen
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods of advanced site-based nanotopography for wafer...
- Patent number 9,177,370
- Issue date Nov 3, 2015
- KLA-Tencor Corporation
- Haiguang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods and systems of object based metrology for advanced wafer su...
- Patent number 9,031,810
- Issue date May 12, 2015
- Haiguang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for improved localized feature quantification i...
- Patent number 8,630,479
- Issue date Jan 14, 2014
- KLA-Tencor Corporation
- Haiguang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for wafer edge feature detection and quantifica...
- Patent number 8,594,975
- Issue date Nov 26, 2013
- KLA-Tencor Corporation
- Haiguang Chen
- G01 - MEASURING TESTING
Information Patent Grant
Computer-implemented methods, computer-readable media, and systems...
- Patent number 8,494,802
- Issue date Jul 23, 2013
- KLA-Tencor Corp.
- Haiguang Chen
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Process-Induced Distortion Prediction and Feedforward and Feedback...
- Publication number 20190353582
- Publication date Nov 21, 2019
- KLA-Tencor Corporation
- Pradeep Vukkadala
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS, METHODS AND METRICS FOR WAFER HIGH ORDER SHAPE CHARACTERIZ...
- Publication number 20190271654
- Publication date Sep 5, 2019
- KLA-Tencor Corporation
- Haiguang Chen
- G01 - MEASURING TESTING
Information Patent Application
Hybrid Phase Unwrapping Systems and Methods for Patterned Wafer Mea...
- Publication number 20160321799
- Publication date Nov 3, 2016
- KLA-Tencor Corporation
- Haiguang Chen
- G01 - MEASURING TESTING
Information Patent Application
System and Method to Emulate Finite Element Model Based Prediction...
- Publication number 20160283625
- Publication date Sep 29, 2016
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Process-Induced Distortion Prediction and Feedforward and Feedback...
- Publication number 20150120216
- Publication date Apr 30, 2015
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G01 - MEASURING TESTING
Information Patent Application
Systems, Methods and Metrics for Wafer High Order Shape Characteriz...
- Publication number 20140114597
- Publication date Apr 24, 2014
- KLA-Tencor Corporation
- Haiguang Chen
- G01 - MEASURING TESTING
Information Patent Application
System and Method to Emulate Finite Element Model Based Prediction...
- Publication number 20140107998
- Publication date Apr 17, 2014
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR WAFER SURFACE FEATURE DETECTION, CLASSIFICA...
- Publication number 20130304399
- Publication date Nov 14, 2013
- KLA-Tencor Corporation
- Haiguang Chen
- G01 - MEASURING TESTING
Information Patent Application
Systems and Methods of Advanced Site-Based Nanotopography for Wafer...
- Publication number 20130236085
- Publication date Sep 12, 2013
- KLA-Tencor Corporation
- Haiguang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS AND SYSTEMS OF OBJECT BASED METROLOGY FOR ADVANCED WAFER SU...
- Publication number 20120179419
- Publication date Jul 12, 2012
- KLA-Tencor Corporation
- Haiguang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVED LOCALIZED FEATURE QUANTIFICATION I...
- Publication number 20120177282
- Publication date Jul 12, 2012
- KLA-Tencor Corporation
- Haiguang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR WAFER EDGE FEATURE DETECTION AND QUANTIFICA...
- Publication number 20110218762
- Publication date Sep 8, 2011
- KLA-Tencor Corporation
- Haiguang Chen
- G01 - MEASURING TESTING
Information Patent Application
COMPUTER-IMPLEMENTED METHODS, COMPUTER-READABLE MEDIA, AND SYSTEMS...
- Publication number 20110196639
- Publication date Aug 11, 2011
- Kla-Tencor Corporation
- Haiguang Chen
- G06 - COMPUTING CALCULATING COUNTING

Haiguang Chen

Person

Patents Grantslast 30 patents

Process-induced distortion prediction and feedforward and feedback...

Systems, methods and metrics for wafer high order shape characteriz...

Systems and methods for wafer structure uniformity monitoring using...

Systems and methods for wafer surface feature detection, classifica...

System and method to emulate finite element model based prediction...

Systems and methods for effective pattern wafer surface measurement...

Systems and methods for wafer surface feature detection and quantif...

Detection of selected defects in relatively noisy inspection data

Hybrid phase unwrapping systems and methods for patterned wafer mea...

Systems, methods and metrics for wafer high order shape characteriz...

System and method to emulate finite element model based prediction...

Detection of selected defects in relatively noisy inspection data

Systems and methods of advanced site-based nanotopography for wafer...

Methods and systems of object based metrology for advanced wafer su...

Methods and systems for improved localized feature quantification i...

Systems and methods for wafer edge feature detection and quantifica...

Computer-implemented methods, computer-readable media, and systems...

Patents Applicationslast 30 patents

Process-Induced Distortion Prediction and Feedforward and Feedback...

SYSTEMS, METHODS AND METRICS FOR WAFER HIGH ORDER SHAPE CHARACTERIZ...

Hybrid Phase Unwrapping Systems and Methods for Patterned Wafer Mea...

System and Method to Emulate Finite Element Model Based Prediction...

Process-Induced Distortion Prediction and Feedforward and Feedback...

Systems, Methods and Metrics for Wafer High Order Shape Characteriz...

System and Method to Emulate Finite Element Model Based Prediction...

SYSTEMS AND METHODS FOR WAFER SURFACE FEATURE DETECTION, CLASSIFICA...

Systems and Methods of Advanced Site-Based Nanotopography for Wafer...

METHODS AND SYSTEMS OF OBJECT BASED METROLOGY FOR ADVANCED WAFER SU...

METHODS AND SYSTEMS FOR IMPROVED LOCALIZED FEATURE QUANTIFICATION I...

SYSTEMS AND METHODS FOR WAFER EDGE FEATURE DETECTION AND QUANTIFICA...

COMPUTER-IMPLEMENTED METHODS, COMPUTER-READABLE MEDIA, AND SYSTEMS...