Haijing Cao

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Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming shielding layer over int...
- Patent number 10,211,183
- Issue date Feb 19, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming vertical interconnect st...
- Patent number 10,192,801
- Issue date Jan 29, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a fan-out structure with...
- Patent number 9,865,482
- Issue date Jan 9, 2018
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive devices
- Patent number 9,449,925
- Issue date Sep 20, 2016
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming passive devices
- Patent number 9,349,723
- Issue date May 24, 2016
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an inductor on a semiconductor wafer
- Patent number 9,337,141
- Issue date May 10, 2016
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming shielding layer over int...
- Patent number 9,324,700
- Issue date Apr 26, 2016
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an IPD over a high-resis...
- Patent number 9,269,598
- Issue date Feb 23, 2016
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with solder bump formed on high topography pla...
- Patent number 9,240,384
- Issue date Jan 19, 2016
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having embedded integrated passive devices ele...
- Patent number 9,184,103
- Issue date Nov 10, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive device system
- Patent number 8,669,637
- Issue date Mar 11, 2014
- Stats Chippac Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming passive circuit element...
- Patent number 8,592,311
- Issue date Nov 26, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with semiconductor core structure and method...
- Patent number 8,445,323
- Issue date May 21, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making integrated passive devices
- Patent number 8,409,970
- Issue date Apr 2, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit system with circuit element and reference plane
- Patent number 8,395,053
- Issue date Mar 12, 2013
- Stats Chippac Ltd.
- Yaojian Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacture of integrated circuit package system with pr...
- Patent number 8,389,396
- Issue date Mar 5, 2013
- Stats Chippac Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an inductor on a semiconductor wafer
- Patent number 8,309,452
- Issue date Nov 13, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming passive circuit element...
- Patent number 8,310,058
- Issue date Nov 13, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with solder bump formed on high topography pla...
- Patent number 8,304,904
- Issue date Nov 6, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an IPD over a high-resis...
- Patent number 8,263,437
- Issue date Sep 11, 2012
- STATS ChiPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with semiconductor core structure and method...
- Patent number 8,193,604
- Issue date Jun 5, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a fan-out structure with...
- Patent number 8,183,087
- Issue date May 22, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming vertical interconnect st...
- Patent number 8,168,470
- Issue date May 1, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit system with metal-insulator-metal circuit element
- Patent number 8,134,196
- Issue date Mar 13, 2012
- Stats Chippac Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming passive devices
- Patent number 8,124,490
- Issue date Feb 28, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming high-frequency circuit s...
- Patent number 8,110,477
- Issue date Feb 7, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with protected conductive layers...
- Patent number 8,026,593
- Issue date Sep 27, 2011
- Stats Chippac Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with bump pad
- Patent number 8,008,770
- Issue date Aug 30, 2011
- Stats Chippac Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level die integration and method therefor
- Patent number 7,993,972
- Issue date Aug 9, 2011
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of embedding integrated passive dev...
- Patent number 7,935,570
- Issue date May 3, 2011
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Shielding Layer over Int...
- Publication number 20160197059
- Publication date Jul 7, 2016
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making Integrated Passive Devices
- Publication number 20130175668
- Publication date Jul 11, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Solder Bump Formed on High Topography Pla...
- Publication number 20130015575
- Publication date Jan 17, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming an Inductor on a Semiconductor Wafer
- Publication number 20130015555
- Publication date Jan 17, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming Passive Circuit Element...
- Publication number 20130015554
- Publication date Jan 17, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an IPD over a High-Resis...
- Publication number 20120292738
- Publication date Nov 22, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Protecting Passivation Layer in...
- Publication number 20120211881
- Publication date Aug 23, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Fan-Out Structure with...
- Publication number 20120187572
- Publication date Jul 26, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Semiconductor Core Structure and Method...
- Publication number 20120175732
- Publication date Jul 12, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Vertical Interconnect St...
- Publication number 20120175784
- Publication date Jul 12, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Passive Devices
- Publication number 20120126369
- Publication date May 24, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURE OF INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PR...
- Publication number 20120003830
- Publication date Jan 5, 2012
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Die Integration and Method Therefor
- Publication number 20110254155
- Publication date Oct 20, 2011
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Embedded Integrated Passive Devices Ele...
- Publication number 20110163414
- Publication date Jul 7, 2011
- STATS ChiPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Semiconductor Core Structure and Method...
- Publication number 20110068468
- Publication date Mar 24, 2011
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming High-Frequency Circuit S...
- Publication number 20100264512
- Publication date Oct 21, 2010
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming an Inductor on a Semiconductor Wafer
- Publication number 20100264516
- Publication date Oct 21, 2010
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Protecting Passivation Layer in...
- Publication number 20100200985
- Publication date Aug 12, 2010
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Embedding Integrated Passive Dev...
- Publication number 20100140736
- Publication date Jun 10, 2010
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Vertical Interconnect St...
- Publication number 20100140772
- Publication date Jun 10, 2010
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Semiconductor Core Structure and Method...
- Publication number 20100140779
- Publication date Jun 10, 2010
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming Passive Circuit Element...
- Publication number 20100140737
- Publication date Jun 10, 2010
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Solder Bump Formed on High Topography Pla...
- Publication number 20100133687
- Publication date Jun 3, 2010
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming High-Frequency Circuit S...
- Publication number 20100065942
- Publication date Mar 18, 2010
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Shielding Layer over Int...
- Publication number 20100059853
- Publication date Mar 11, 2010
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Fan-Out Structure with...
- Publication number 20100059855
- Publication date Mar 11, 2010
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an IPD over a High-Resis...
- Publication number 20100059854
- Publication date Mar 11, 2010
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device With Integrated Passive Circuit and Method of...
- Publication number 20090230542
- Publication date Sep 17, 2009
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Die Integration and Method Therefor
- Publication number 20090224391
- Publication date Sep 10, 2009
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Integrated Passive Devic...
- Publication number 20090155959
- Publication date Jun 18, 2009
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Haijing Cao

Person

Patents Grantslast 30 patents

Semiconductor device and method of forming shielding layer over int...

Semiconductor device and method of forming vertical interconnect st...

Semiconductor device and method of forming a fan-out structure with...

Integrated passive devices

Semiconductor device and method of forming passive devices

Method of forming an inductor on a semiconductor wafer

Semiconductor device and method of forming shielding layer over int...

Semiconductor device and method of forming an IPD over a high-resis...

Semiconductor device with solder bump formed on high topography pla...

Semiconductor device having embedded integrated passive devices ele...

Integrated passive device system

Semiconductor device and method for forming passive circuit element...

Semiconductor package with semiconductor core structure and method...

Semiconductor device and method of making integrated passive devices

Circuit system with circuit element and reference plane

Method for manufacture of integrated circuit package system with pr...

Method of forming an inductor on a semiconductor wafer

Semiconductor device and method for forming passive circuit element...

Semiconductor device with solder bump formed on high topography pla...

Semiconductor device and method of forming an IPD over a high-resis...

Semiconductor package with semiconductor core structure and method...

Semiconductor device and method of forming a fan-out structure with...

Semiconductor device and method of forming vertical interconnect st...

Integrated circuit system with metal-insulator-metal circuit element

Semiconductor device and method of forming passive devices

Semiconductor device and method of forming high-frequency circuit s...

Integrated circuit package system with protected conductive layers...

Integrated circuit package system with bump pad

Wafer level die integration and method therefor

Semiconductor device and method of embedding integrated passive dev...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming Shielding Layer over Int...

Semiconductor Device and Method of Making Integrated Passive Devices

Semiconductor Device with Solder Bump Formed on High Topography Pla...

Method of Forming an Inductor on a Semiconductor Wafer

Semiconductor Device and Method for Forming Passive Circuit Element...

Semiconductor Device and Method of Forming an IPD over a High-Resis...

Semiconductor Device and Method of Protecting Passivation Layer in...

Semiconductor Device and Method of Forming a Fan-Out Structure with...

Semiconductor Package with Semiconductor Core Structure and Method...

Semiconductor Device and Method of Forming Vertical Interconnect St...

Semiconductor Device and Method of Forming Passive Devices

METHOD FOR MANUFACTURE OF INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PR...

Wafer Level Die Integration and Method Therefor

Semiconductor Device Having Embedded Integrated Passive Devices Ele...

Semiconductor Package with Semiconductor Core Structure and Method...

Semiconductor Device and Method of Forming High-Frequency Circuit S...

Method of Forming an Inductor on a Semiconductor Wafer

Semiconductor Device and Method of Protecting Passivation Layer in...

Semiconductor Device and Method of Embedding Integrated Passive Dev...

Semiconductor Device and Method of Forming Vertical Interconnect St...

Semiconductor Package with Semiconductor Core Structure and Method...

Semiconductor Device and Method for Forming Passive Circuit Element...

Semiconductor Device with Solder Bump Formed on High Topography Pla...

Semiconductor Device and Method of Forming High-Frequency Circuit S...

Semiconductor Device and Method of Forming Shielding Layer over Int...

Semiconductor Device and Method of Forming a Fan-Out Structure with...

Semiconductor Device and Method of Forming an IPD over a High-Resis...

Semiconductor Device With Integrated Passive Circuit and Method of...

Wafer Level Die Integration and Method Therefor

Semiconductor Device and Method of Forming Integrated Passive Devic...