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Haijun Shen

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  • Nantong, CN
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Patents Grantslast 30 patents

  • Information Patent Grant

    Packaging structure
    • Patent number 9,497,862
    • Issue date Nov 15, 2016
    • NANTONG FUJITSU MICROELECTRONICS CO., LTD.
    • Lei Shi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Metal contact for chip packaging structure
    • Patent number 9,293,432
    • Issue date Mar 22, 2016
    • NANTONG FUJITSU MICROELECTRONICS CO., LTD.
    • Chang-Ming Lin
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    CHIP PACKAGING STRUCTURE AND PACKAGING METHOD
    • Publication number 20150294949
    • Publication date Oct 15, 2015
    • NANTONG FUJITSU MICROELECTRONICS CO., LTD.
    • Chang-Ming Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGING STRUCTURE
    • Publication number 20130301228
    • Publication date Nov 14, 2013
    • NANTONG FUJITSU MICROELECTRONICS CO., LTD.
    • Yujuan Tao
    • H01 - BASIC ELECTRIC ELEMENTS