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Hailin WANG
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Hefei, CN
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last 30 patents
Information
Patent Grant
Method for adjusting chip mounting position, apparatus, medium, and...
Patent number
12,327,740
Issue date
Jun 10, 2025
CHANGXIN MEMORY TECHNOLOGIES, INC.
Hailin Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrate and semiconductor structure with package substrate
Patent number
12,293,964
Issue date
May 6, 2025
CHANGXIN MEMORY TECHNOLOGIES, INC.
Hailin Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrate and semiconductor structure with same
Patent number
12,224,244
Issue date
Feb 11, 2025
CHANGXIN MEMORY TECHNOLOGIES, INC.
Hailin Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure
Patent number
11,990,390
Issue date
May 21, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Ping-Heng Wu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR STRUCTURE WITH SAME
Publication number
20250096144
Publication date
Mar 20, 2025
Changxin Memory Technologies, Inc.
Hailin WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR ADJUSTING CHIP MOUNTING POSITION, APPARATUS, MEDIUM, AND...
Publication number
20220367219
Publication date
Nov 17, 2022
CHANGXIN MEMORY TECHNOLOGIES, INC
Hailin WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR STRUCTURE WITH PACKAGE SUBSTRATE
Publication number
20220254709
Publication date
Aug 11, 2022
CHANGXIN MEMORY TECHNOLOGIES, INC
Hailin WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR STRUCTURE WITH SAME
Publication number
20220254720
Publication date
Aug 11, 2022
CHANGXIN MEMORY TECHNOLOGIES, INC
Hailin WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20220005747
Publication date
Jan 6, 2022
Changxin Memory Technologies, Inc.
PING-HENG WU
H01 - BASIC ELECTRIC ELEMENTS