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last 30 patents
Information
Patent Grant
Semiconductor device having inter-metal dielectric patterns and met...
Patent number
11,749,601
Issue date
Sep 5, 2023
United Semiconductor (Xiamen) Co., Ltd.
Bin Guo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having inter-metal dielectric patterns and met...
Patent number
11,201,116
Issue date
Dec 14, 2021
United Semiconductor (Xiamen) Co., Ltd.
Bin Guo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating semiconductor device
Patent number
11,107,723
Issue date
Aug 31, 2021
United Semiconductor (Xiamen) Co., Ltd.
Long Wang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING INTER-METAL DIELECTRIC PATTERNS AND MET...
Publication number
20230361034
Publication date
Nov 9, 2023
United Semiconductor (Xiamen) Co., Ltd.
BIN GUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TESTKEY STRUCTURE FOR SEMICONDUCTOR DEVICE
Publication number
20230245934
Publication date
Aug 3, 2023
United Semiconductor (Xiamen) Co., Ltd.
Zhi Xiang Qiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING INTER-METAL DIELECTRIC PATTERNS AND MET...
Publication number
20220077058
Publication date
Mar 10, 2022
United Semiconductor (Xiamen) Co., Ltd.
BIN GUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of fabricating semiconductor device
Publication number
20210257249
Publication date
Aug 19, 2021
United Semiconductor (Xiamen) Co., Ltd.
Long Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING INTER-METAL DIELECTRIC PATTERNS AND MET...
Publication number
20210242129
Publication date
Aug 5, 2021
United Semiconductor (Xiamen) Co., Ltd.
BIN GUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING ISOLATING STRUCTURE AND THROUGH SILICON VIA
Publication number
20140357050
Publication date
Dec 4, 2014
JI FENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Through silicon via structure and method of fabricating the same
Publication number
20130200519
Publication date
Aug 8, 2013
Ji Feng
H01 - BASIC ELECTRIC ELEMENTS