Haitao Fu

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
High-density optical waveguide structure and printed circuit board...
- Patent number 11,693,181
- Issue date Jul 4, 2023
- TTM Technologies, Inc.
- Xinhong Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of preparing printed circuit boards and packaging substrate...
- Patent number 8,277,668
- Issue date Oct 2, 2012
- Shanghai Meadville Science & Technology Co., Ltd.
- FanXiong Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PREPARING FCBGA PACKAGE SUBSTRATE
- Publication number 20250087500
- Publication date Mar 13, 2025
- Shanghai Meadville Science & Technology Co., Ltd.
- Wei YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY OPTICAL WAVEGUIDE STRUCTURE AND PRINTED CIRCUIT BOARD...
- Publication number 20210247568
- Publication date Aug 12, 2021
- TTM TECHNOLOGIES, INC.
- Xinhong SHI
- G02 - OPTICS
Information Patent Application
Methods of preparing printed circuit boards and packaging substrate...
- Publication number 20080251495
- Publication date Oct 16, 2008
- Shanghai Meadville Science & Technology Co., Ltd.
- FanXiong Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR