Haiwei Lu

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Multi-chip packaging of silicon photonics
- Patent number 12,019,269
- Issue date Jun 25, 2024
- Ayar Labs, Inc.
- Roy Edward Meade
- G02 - OPTICS
Information Patent Grant
Multi-chip packaging of silicon photonics
- Patent number 11,500,153
- Issue date Nov 15, 2022
- Ayar Labs, Inc.
- Roy Edward Meade
- G02 - OPTICS
Information Patent Grant
Wafer-level handle replacement processing
- Patent number 11,156,773
- Issue date Oct 26, 2021
- Ayar Labs, Inc.
- Haiwei Lu
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
Direct Silicon-to-Silicon Bonding for Fiber-First Packaging Process
- Publication number 20250044534
- Publication date Feb 6, 2025
- Ayar Labs, Inc.
- Chong Zhang
- G02 - OPTICS
Information Patent Application
Multi-Chip Packaging of Silicon Photonics
- Publication number 20230070458
- Publication date Mar 9, 2023
- Ayar Labs, Inc.
- Roy Edward Meade
- G02 - OPTICS
Information Patent Application
Multi-Chip Packaging of Silicon Photonics
- Publication number 20210109284
- Publication date Apr 15, 2021
- Ayar Labs, Inc.
- Roy Edward Meade
- G02 - OPTICS
Information Patent Application
Wafer-Level Handle Replacement Processing
- Publication number 20210080647
- Publication date Mar 18, 2021
- Ayar Labs, Inc.
- Haiwei Lu
- G02 - OPTICS