Hajime AKIYAMA

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
SiC-SOI device and manufacturing method thereof
- Patent number 10,868,123
- Issue date Dec 15, 2020
- Mitsubishi Electric Corporation
- Hajime Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for testing same
- Patent number 10,228,412
- Issue date Mar 12, 2019
- Mitsubishi Electric Corporation
- Hajime Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waste gasification melting apparatus and waste gasification melting...
- Patent number 10,228,129
- Issue date Mar 12, 2019
- JFE Engineering Corporation
- Satoshi Horiuchi
- F23 - COMBUSTION APPARATUS COMBUSTION PROCESSES
Information Patent Grant
Semiconductor device and electrical contact structure thereof
- Patent number 10,192,797
- Issue date Jan 29, 2019
- Mitsubishi Electric Corporation
- Hajime Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for evaluating semiconductor device comprising...
- Patent number 10,068,814
- Issue date Sep 4, 2018
- Mitsubishi Electric Corporation
- Akira Okada
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and method for evaluating semiconductor device
- Patent number 9,995,786
- Issue date Jun 12, 2018
- Mitsubishi Electric Corporation
- Akira Okada
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor evaluation apparatus
- Patent number 9,678,143
- Issue date Jun 13, 2017
- Mitsubishi Electric Corporation
- Akira Okada
- G01 - MEASURING TESTING
Information Patent Grant
Foreign matter removal device and foreign matter removal method
- Patent number 9,659,795
- Issue date May 23, 2017
- Mitsubishi Electric Corporation
- Akira Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assessment apparatus
- Patent number 9,551,745
- Issue date Jan 24, 2017
- Mitsubishi Electric Corporation
- Hajime Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor testing jig and semiconductor testing method performe...
- Patent number 9,347,988
- Issue date May 24, 2016
- Mitsubishi Electric Corporation
- Hajime Akiyama
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor evaluating device and semiconductor evaluating method
- Patent number 9,335,371
- Issue date May 10, 2016
- Mitsubishi Electric Corporation
- Hajime Akiyama
- G01 - MEASURING TESTING
Information Patent Grant
Wafer suction method, wafer suction stage, and wafer suction system
- Patent number 9,312,160
- Issue date Apr 12, 2016
- Mitsubishi Electric Corporation
- Hajime Akiyama
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor testing jig and transfer jig for the same
- Patent number 9,257,316
- Issue date Feb 9, 2016
- Mitsubishi Electric Corporation
- Akira Okada
- G01 - MEASURING TESTING
Information Patent Grant
Inspection apparatus
- Patent number 9,207,257
- Issue date Dec 8, 2015
- Mitsubishi Electric Corporation
- Akira Okada
- G01 - MEASURING TESTING
Information Patent Grant
Inspection apparatus
- Patent number 9,188,624
- Issue date Nov 17, 2015
- Mitsubishi Electric Corporation
- Akira Okada
- G01 - MEASURING TESTING
Information Patent Grant
Probe card
- Patent number 9,157,931
- Issue date Oct 13, 2015
- Mitsubishi Electric Corporation
- Akira Okada
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device
- Patent number 9,121,899
- Issue date Sep 1, 2015
- Mitsubishi Electric Corporation
- Hajime Akiyama
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 9,117,880
- Issue date Aug 25, 2015
- Mitsubishi Electric Corporation
- Hajime Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor cleaning device and semiconductor cleaning method
- Patent number 9,117,656
- Issue date Aug 25, 2015
- Mitsubishi Electric Corporation
- Akira Okada
- B08 - CLEANING
Information Patent Grant
Test apparatus and test method
- Patent number 8,980,655
- Issue date Mar 17, 2015
- Mitsubishi Electric Corporation
- Akira Okada
- G01 - MEASURING TESTING
Information Patent Grant
Inspection apparatus and inspection method
- Patent number 8,981,805
- Issue date Mar 17, 2015
- Mitsubishi Electric Corporation
- Akira Okada
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device
- Patent number 8,975,681
- Issue date Mar 10, 2015
- Mitsubishi Electric Corporation
- Hajime Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,823,360
- Issue date Sep 2, 2014
- Mitsubishi Electric Corporation
- Hajime Akiyama
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 8,609,443
- Issue date Dec 17, 2013
- Mitsubishi Denki Kabushiki Kaisha
- Kazuhiro Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,324,657
- Issue date Dec 4, 2012
- Mitsubishi Denki Kabushiki Kaisha
- Kazuhiro Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric isolation type semiconductor device and manufacturing me...
- Patent number 8,125,045
- Issue date Feb 28, 2012
- Mitsubishi Denki Kabushiki Kaisha
- Hajime Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,110,449
- Issue date Feb 7, 2012
- Mitsubishi Electric Corporation
- Hajime Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing dielectric isolation type semiconductor de...
- Patent number 8,071,454
- Issue date Dec 6, 2011
- Mitsubishi Electric Corporation
- Hajime Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,977,787
- Issue date Jul 12, 2011
- Mitsubishi Denki Kabushiki Kaisha
- Kazuhiro Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,851,873
- Issue date Dec 14, 2010
- Mitsubishi Electric Corporation
- Hajime Akiyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SiC-SOI DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200027954
- Publication date Jan 23, 2020
- Mitsubishi Electric Corporation
- Hajime AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR EVALUATING SEMICONDUCTOR DEVICE
- Publication number 20170139002
- Publication date May 18, 2017
- Mitsubishi Electric Corporation
- Akira OKADA
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS AND METHOD FOR EVALUATING SEMICONDUCTOR DEVICE
- Publication number 20170092553
- Publication date Mar 30, 2017
- Mitsubishi Electric Corporation
- Akira OKADA
- G01 - MEASURING TESTING
Information Patent Application
CONTACT-PROBE TYPE TEMPERATURE DETECTOR, SEMICONDUCTOR DEVICE EVALU...
- Publication number 20160377486
- Publication date Dec 29, 2016
- Mitsubishi Electric Corporation
- Kinya YAMASHITA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160343627
- Publication date Nov 24, 2016
- Mitsubishi Electric Corporation
- Hajime AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR TESTING SAME
- Publication number 20160334458
- Publication date Nov 17, 2016
- Mitsubishi Electric Corporation
- Hajime AKIYAMA
- G01 - MEASURING TESTING
Information Patent Application
WASTE GASIFICATION MELTING APPARATUS AND WASTE GASIFICATION MELTING...
- Publication number 20160053992
- Publication date Feb 25, 2016
- JFE Engineering Corporation
- Satoshi Horiuchi
- F23 - COMBUSTION APPARATUS COMBUSTION PROCESSES
Information Patent Application
SEMICONDUCTOR EVALUATION APPARATUS
- Publication number 20150115989
- Publication date Apr 30, 2015
- Mitsubishi Electric Corporation
- Akira OKADA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR TESTING JIG AND TRANSFER JIG FOR THE SAME
- Publication number 20150091599
- Publication date Apr 2, 2015
- Mitsubishi Electric Corporation
- Akira OKADA
- G01 - MEASURING TESTING
Information Patent Application
TEST APPARATUS AND TEST METHOD
- Publication number 20150044788
- Publication date Feb 12, 2015
- Mitsubishi Electric Corporation
- Akira OKADA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE ASSESSMENT APPARATUS
- Publication number 20140347081
- Publication date Nov 27, 2014
- Mitsubishi Electric Corporation
- Hajime AKIYAMA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140346514
- Publication date Nov 27, 2014
- MITSUBISHI ELECTRIC CORPORATION
- Hajime Akiyama
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140342544
- Publication date Nov 20, 2014
- Mitsubishi Electric Corporation
- Hajime AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR EVALUATING DEVICE AND SEMICONDUCTOR EVALUATING METHOD
- Publication number 20140210500
- Publication date Jul 31, 2014
- Mitsubishi Electric Corporation
- Hajime AKIYAMA
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF WASTE MELTING TREATMENT
- Publication number 20140202364
- Publication date Jul 24, 2014
- KINKI UNIVERSITY
- Takashi Nakayama
- F23 - COMBUSTION APPARATUS COMBUSTION PROCESSES
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140077284
- Publication date Mar 20, 2014
- Hajime AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSPECTION APPARATUS
- Publication number 20140015554
- Publication date Jan 16, 2014
- Mitsubishi Electric Corporation
- Akira OKADA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR TESTING JIG AND SEMICONDUCTOR TESTING METHOD PERFORME...
- Publication number 20140009183
- Publication date Jan 9, 2014
- Mitsubishi Electric Corporation
- Hajime AKIYAMA
- G01 - MEASURING TESTING
Information Patent Application
INSPECTION APPARATUS AND INSPECTION METHOD
- Publication number 20130321015
- Publication date Dec 5, 2013
- Mitsubishi Electric Corporation
- Akira OKADA
- G01 - MEASURING TESTING
Information Patent Application
PROBE CARD
- Publication number 20130321019
- Publication date Dec 5, 2013
- Mitsubishi Electric Corporation
- Akira OKADA
- G01 - MEASURING TESTING
Information Patent Application
INSPECTION APPARATUS
- Publication number 20130285684
- Publication date Oct 31, 2013
- Akira OKADA
- G01 - MEASURING TESTING
Information Patent Application
WAFER SUCTION METHOD, WAFER SUCTION STAGE, AND WAFER SUCTION SYSTEM
- Publication number 20130256964
- Publication date Oct 3, 2013
- Mitsubishi Electric Corporation
- Hajime AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOREIGN MATTER REMOVAL DEVICE AND FOREIGN MATTER REMOVAL METHOD
- Publication number 20130192630
- Publication date Aug 1, 2013
- Mitsubishi Electric Corporation
- Akira OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CLEANING DEVICE AND SEMICONDUCTOR CLEANING METHOD
- Publication number 20130152965
- Publication date Jun 20, 2013
- Mitsubishi Electric Corporation
- Akira OKADA
- B08 - CLEANING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130056791
- Publication date Mar 7, 2013
- Kazuhiro Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120161751
- Publication date Jun 28, 2012
- MITSUBISHI ELECTRIC CORPORATION
- Hajime Akiyama
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MANUFACTURING DIELECTRIC ISOLATION TYPE SEMICONDUCTOR DE...
- Publication number 20110281419
- Publication date Nov 17, 2011
- Mitsubishi Electric Corporation
- Hajime AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110254049
- Publication date Oct 20, 2011
- Mitsubishi Denki Kabushiki Kaisha
- Kazuhiro Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110053348
- Publication date Mar 3, 2011
- MITSUBISHI ELECTRIC CORPORATION
- Hajime AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC ISOLATION TYPE SEMICONDUCTOR DEVICE AND MANUFACTURING ME...
- Publication number 20090140377
- Publication date Jun 4, 2009
- Mitsubishi Denki Kabushiki Kaisha
- Hajime Akiyama
- H01 - BASIC ELECTRIC ELEMENTS

Hajime AKIYAMA

Person

Patents Grantslast 30 patents

SiC-SOI device and manufacturing method thereof

Semiconductor device and method for testing same

Waste gasification melting apparatus and waste gasification melting...

Semiconductor device and electrical contact structure thereof

Apparatus and method for evaluating semiconductor device comprising...

Apparatus and method for evaluating semiconductor device

Semiconductor evaluation apparatus

Foreign matter removal device and foreign matter removal method

Semiconductor device assessment apparatus

Semiconductor testing jig and semiconductor testing method performe...

Semiconductor evaluating device and semiconductor evaluating method

Wafer suction method, wafer suction stage, and wafer suction system

Semiconductor testing jig and transfer jig for the same

Inspection apparatus

Inspection apparatus

Probe card

Semiconductor device

Method for manufacturing semiconductor device

Semiconductor cleaning device and semiconductor cleaning method

Test apparatus and test method

Inspection apparatus and inspection method

Semiconductor device

Semiconductor device

Semiconductor device manufacturing method

Semiconductor device

Dielectric isolation type semiconductor device and manufacturing me...

Semiconductor device and method of manufacturing the same

Method for manufacturing dielectric isolation type semiconductor de...

Semiconductor device

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

SiC-SOI DEVICE AND MANUFACTURING METHOD THEREOF

APPARATUS AND METHOD FOR EVALUATING SEMICONDUCTOR DEVICE

APPARATUS AND METHOD FOR EVALUATING SEMICONDUCTOR DEVICE

CONTACT-PROBE TYPE TEMPERATURE DETECTOR, SEMICONDUCTOR DEVICE EVALU...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR TESTING SAME

WASTE GASIFICATION MELTING APPARATUS AND WASTE GASIFICATION MELTING...

SEMICONDUCTOR EVALUATION APPARATUS

SEMICONDUCTOR TESTING JIG AND TRANSFER JIG FOR THE SAME

TEST APPARATUS AND TEST METHOD

SEMICONDUCTOR DEVICE ASSESSMENT APPARATUS

SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR EVALUATING DEVICE AND SEMICONDUCTOR EVALUATING METHOD

METHOD OF WASTE MELTING TREATMENT

SEMICONDUCTOR DEVICE

INSPECTION APPARATUS

SEMICONDUCTOR TESTING JIG AND SEMICONDUCTOR TESTING METHOD PERFORME...

INSPECTION APPARATUS AND INSPECTION METHOD

PROBE CARD

INSPECTION APPARATUS

WAFER SUCTION METHOD, WAFER SUCTION STAGE, AND WAFER SUCTION SYSTEM

FOREIGN MATTER REMOVAL DEVICE AND FOREIGN MATTER REMOVAL METHOD

SEMICONDUCTOR CLEANING DEVICE AND SEMICONDUCTOR CLEANING METHOD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING DIELECTRIC ISOLATION TYPE SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

DIELECTRIC ISOLATION TYPE SEMICONDUCTOR DEVICE AND MANUFACTURING ME...