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Hajime FUNAHASHI
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Oyama-shi, Tochigi, JP
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Patents Applications
last 30 patents
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Patent Application
HEAT CONDUCTING COMPOSITION AND CURED PRODUCT THEREOF
Publication number
20240101885
Publication date
Mar 28, 2024
Resonac Corporation
Hikaru SATOH
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
METHOD FOR PRODUCING SURFACE-TREATED THERMALLY CONDUCTIVE FILLER, A...
Publication number
20240059901
Publication date
Feb 22, 2024
Resonac Corporation
Naoki MINORIKAWA
C01 - INORGANIC CHEMISTRY
Information
Patent Application
THERMALLY CONDUCTIVE URETHANE RESIN COMPOSITION AND CURED PRODUCT
Publication number
20240052223
Publication date
Feb 15, 2024
SHOWA DENKO K.K.
Hajime FUNAHASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY CONDUCTIVE COMPOSITION
Publication number
20240052224
Publication date
Feb 15, 2024
Resonac Corporation
Naoki MINORIKAWA
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
THERMALLY CONDUCTIVE RESIN COMPOSITION, CURED PRODUCT, HEAT TRANSFE...
Publication number
20240052225
Publication date
Feb 15, 2024
Resonac Corporation
Hajime YUKUTAKE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Application
HEAT CONDUCTING COMPOSITION
Publication number
20240043659
Publication date
Feb 8, 2024
Resonac Corporation
Hajime FUNAHASHI
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
SURFACE-TREATED FILLER, METHOD FOR PRODUCING SURFACE-TREATED FILLER...
Publication number
20240026055
Publication date
Jan 25, 2024
Resonac Corporation
Hajime FUNAHASHI
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
THERMALLY CONDUCTIVE COMPOSITION
Publication number
20230399512
Publication date
Dec 14, 2023
Resonac Corporation
Hajime FUNAHASHI
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
THERMALLY CONDUCTIVE COMPOSITION
Publication number
20230313017
Publication date
Oct 5, 2023
Resonac Corporation
Hajime FUNAHASHI
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
THERMALLY CONDUCTIVE COMPOSITION, CURED PRODUCT AND ELECTRONIC COMP...
Publication number
20230287213
Publication date
Sep 14, 2023
Resonac Corporation
Hajime FUNAHASHI
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
THERMALLY CONDUCTIVE COMPOSITION AND CURED PRODUCT THEREOF
Publication number
20230227707
Publication date
Jul 20, 2023
SHOWA DENKO K.K.
Hajime YUKUTAKE
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...