Hajime Iizuka

Person

Nagano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic part embedded substrate and method of producing an elect...
- Patent number 10,134,680
- Issue date Nov 20, 2018
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part embedded substrate and method of producing an elect...
- Patent number 9,768,122
- Issue date Sep 19, 2017
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip embedded substrate and method of producing the same
- Patent number 9,451,702
- Issue date Sep 20, 2016
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component incorporated substrate and method for manufact...
- Patent number 9,137,900
- Issue date Sep 15, 2015
- Shinko Electric Industries Co., Ltd.
- Koichi Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component incorporated substrate
- Patent number 9,036,362
- Issue date May 19, 2015
- Shinko Electric Industries Co., Ltd.
- Koichi Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 8,994,134
- Issue date Mar 31, 2015
- Shinko Electric Industires Co., Ltd.
- Hajime Iizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Built-in electronic component substrate and method for manufacturin...
- Patent number 8,987,919
- Issue date Mar 24, 2015
- Shinko Electric Industries Co., Ltd.
- Koichi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip embedded substrate and method of producing the same
- Patent number 8,793,868
- Issue date Aug 5, 2014
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 8,736,053
- Issue date May 27, 2014
- Shinko Electric Industries Co., Ltd.
- Koichi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip embedded substrate and method of producing the same
- Patent number 7,989,707
- Issue date Aug 2, 2011
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 7,884,484
- Issue date Feb 8, 2011
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electronic component integrated substrate
- Patent number 7,827,681
- Issue date Nov 9, 2010
- Shinko Electric Industries Co., Ltd.
- Nobuyuki Kurashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 6,472,745
- Issue date Oct 29, 2002
- Shinko Electric Industries Co., Ltd.
- Hajime Iizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating bump electrode
- Patent number 6,380,061
- Issue date Apr 30, 2002
- Shinko Electric Industries Co., Ltd.
- Syoichi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for producing same
- Patent number 6,198,169
- Issue date Mar 6, 2001
- Shinko Electric Industries Co., Ltd.
- Syoichi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making a chip sized semiconductor device
- Patent number 5,960,308
- Issue date Sep 28, 1999
- Shinko Electric Industries Co. Ltd.
- Masatoshi Akagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an element with circuit pattern thereon
- Patent number 5,834,844
- Issue date Nov 10, 1998
- Shinko Electric Industries Co., Ltd.
- Masatoshi Akagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and mount structure thereof
- Patent number 5,777,386
- Issue date Jul 7, 1998
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi Higashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...
- Publication number 20170365559
- Publication date Dec 21, 2017
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...
- Publication number 20160358858
- Publication date Dec 8, 2016
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20140313681
- Publication date Oct 23, 2014
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUILT-IN ELECTRONIC COMPONENT SUBSTRATE AND METHOD FOR MANUFACTURIN...
- Publication number 20140210109
- Publication date Jul 31, 2014
- Shinko Electric Industries Co., Ltd.
- Koichi TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT INCORPORATED SUBSTRATE
- Publication number 20140063764
- Publication date Mar 6, 2014
- Shinko Electric Industries Co., LTD.
- Koichi TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT INCORPORATED SUBSTRATE AND METHOD FOR MANUFACT...
- Publication number 20140063768
- Publication date Mar 6, 2014
- Shinko Electric Industries Co., LTD.
- Koichi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND METHOD OF MANUFACTURING...
- Publication number 20140054773
- Publication date Feb 27, 2014
- Nobuyuki KURASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130161776
- Publication date Jun 27, 2013
- Shinko Electric Industries Co., Ltd.
- Hajime IIZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
- Publication number 20120319274
- Publication date Dec 20, 2012
- Shinko Electric Industries Co., Ltd.
- Koichi TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20110256662
- Publication date Oct 20, 2011
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20090008765
- Publication date Jan 8, 2009
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC COMPONENT INTEGRATED SUBSTRATE
- Publication number 20080307642
- Publication date Dec 18, 2008
- Shinko Electric Industries Co., Ltd.
- Nobuyuki Kurashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board and method of manufacturing the same
- Publication number 20060208356
- Publication date Sep 21, 2006
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hajime Iizuka

Person

Patents Grantslast 30 patents

Electronic part embedded substrate and method of producing an elect...

Electronic part embedded substrate and method of producing an elect...

Chip embedded substrate and method of producing the same

Electronic component incorporated substrate and method for manufact...

Electronic component incorporated substrate

Electronic device and method of manufacturing the same

Built-in electronic component substrate and method for manufacturin...

Chip embedded substrate and method of producing the same

Semiconductor device

Chip embedded substrate and method of producing the same

Wiring board and method of manufacturing the same

Method of manufacturing electronic component integrated substrate

Semiconductor device

Process for fabricating bump electrode

Semiconductor device and process for producing same

Process for making a chip sized semiconductor device

Semiconductor device having an element with circuit pattern thereon

Semiconductor device and mount structure thereof

Patents Applicationslast 30 patents

ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...

ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...

CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME

BUILT-IN ELECTRONIC COMPONENT SUBSTRATE AND METHOD FOR MANUFACTURIN...

ELECTRONIC COMPONENT INCORPORATED SUBSTRATE

ELECTRONIC COMPONENT INCORPORATED SUBSTRATE AND METHOD FOR MANUFACT...

ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND METHOD OF MANUFACTURING...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME

CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME

METHOD OF MANUFACTURING ELECTRONIC COMPONENT INTEGRATED SUBSTRATE

Wiring board and method of manufacturing the same