Hajime Inazumi

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Flexible laminate and flexible electronic circuit board formed by u...
- Patent number 8,487,191
- Issue date Jul 16, 2013
- JX Nippon Mining & Metals Corporation
- Nobuhito Makino
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
Liquid Crystal Polymer Film Based Copper-Clad Laminate and Method f...
- Publication number 20140023881
- Publication date Jan 23, 2014
- JX NIPPON MINING & METALS CORPORATION
- Kazuhiko Sakaguchi
- B32 - LAYERED PRODUCTS
Information Patent Application
Two-Layered Copper-Clad Laminate Material, and Method for Producing...
- Publication number 20140017513
- Publication date Jan 16, 2014
- JX NIPPON MINING & METALS CORPORATION
- Hajime Inazumi
- B32 - LAYERED PRODUCTS
Information Patent Application
Two-Layered Copper-Clad Laminate Material, and Method for Producing...
- Publication number 20140011047
- Publication date Jan 9, 2014
- JX NIPPON MINING & METALS CORPORATION
- Hajime Inazumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for Forming Circuit on Flexible Laminate Substrate
- Publication number 20130256006
- Publication date Oct 3, 2013
- JX NIPPON MINING & METALS CORPORATION
- Kazuhiko Sakaguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper-Clad Laminate and Method for Manufacturing Same
- Publication number 20130252019
- Publication date Sep 26, 2013
- JX NIPPON MINING & METALS CORPORATION
- Kazuhiko Sakaguchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF FORMING CIRCUIT ON FLEXIBLE LAMINATE SUBSTRATE
- Publication number 20130001186
- Publication date Jan 3, 2013
- JX NIPPON MINING & METALS CORPORATION
- Kazuhiko Sakaguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Metal-Coated Polyimide Resin Substrate with Excellent Thermal Aging...
- Publication number 20120034475
- Publication date Feb 9, 2012
- JX NIPPON MINING & METALS CORPORATION
- Taku Yoshida
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Flexible Laminate and Flexible Electronic Circuit Board Formed by u...
- Publication number 20120012367
- Publication date Jan 19, 2012
- JX NIPPON MINING & METALS CORPORATION
- Nobuhito Makino
- B32 - LAYERED PRODUCTS
Information Patent Application
Non-Adhesive Flexible Laminate
- Publication number 20110003169
- Publication date Jan 6, 2011
- Nippon Mining & Metals Co., Ltd.
- Nobuhito Makino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hajime Inazumi

Person

Patents Grantslast 30 patents

Flexible laminate and flexible electronic circuit board formed by u...

Patents Applicationslast 30 patents

Liquid Crystal Polymer Film Based Copper-Clad Laminate and Method f...

Two-Layered Copper-Clad Laminate Material, and Method for Producing...

Two-Layered Copper-Clad Laminate Material, and Method for Producing...

Method for Forming Circuit on Flexible Laminate Substrate

Copper-Clad Laminate and Method for Manufacturing Same

METHOD OF FORMING CIRCUIT ON FLEXIBLE LAMINATE SUBSTRATE

Metal-Coated Polyimide Resin Substrate with Excellent Thermal Aging...

Flexible Laminate and Flexible Electronic Circuit Board Formed by u...

Non-Adhesive Flexible Laminate