Hajime INOUE

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Yokohama-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Sinterable bonding material and semiconductor device using the same
- Patent number 10,446,518
- Issue date Oct 15, 2019
- Henkel AG & Co. KGaA
- Hajime Inoue
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Sinterable bonding material and semiconductor device using the same
- Patent number 10,141,283
- Issue date Nov 27, 2018
- Henkel AG & Co. KGaA
- Hajime Inoue
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME
- Publication number 20170294404
- Publication date Oct 12, 2017
- HENKEL AG & GO. KGAA
- Hajime INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME
- Publication number 20170294396
- Publication date Oct 12, 2017
- Henkel AG & Co. KGaA
- Hajime INOUE
- H01 - BASIC ELECTRIC ELEMENTS