Hajime ITOKAWA

Person

Annaka-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for packing quartz glass cloth
- Patent number 12,116,304
- Issue date Oct 15, 2024
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Low dielectric silica powder, resin composition containing the sili...
- Patent number 12,098,290
- Issue date Sep 24, 2024
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Resin substrate having dielectric characteristics with little frequ...
- Patent number 11,920,011
- Issue date Mar 5, 2024
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Low dielectric resin substrate
- Patent number 11,802,192
- Issue date Oct 31, 2023
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PACKING QUARTZ GLASS CLOTH
- Publication number 20240262735
- Publication date Aug 8, 2024
- Shin-Etsu Chemical Co., Ltd.
- Toshio SHIOBARA
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
LOW DIELECTRIC SILICA POWDER, RESIN COMPOSITION CONTAINING THE SILI...
- Publication number 20240174863
- Publication date May 30, 2024
- Shin-Etsu Chemical Co., Ltd.
- Toshio SHIOBARA
- C01 - INORGANIC CHEMISTRY
Information Patent Application
Glass Cloth and Method of Manufacture
- Publication number 20240140863
- Publication date May 2, 2024
- Shin-Etsu Chemical Co., Ltd.
- Hajime ITOKAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN SUBSTRATE HAVING DIELECTRIC CHARACTERISTICS WITH LITTLE FREQU...
- Publication number 20220275158
- Publication date Sep 1, 2022
- Shin-Etsu Chemical Co., Ltd.
- Toshio SHIOBARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LOW DIELECTRIC RESIN SUBSTRATE
- Publication number 20210403672
- Publication date Dec 30, 2021
- Shin-Etsu Chemical Co., Ltd.
- Toshio SHIOBARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LOW DIELECTRIC SILICA POWDER, RESIN COMPOSITION CONTAINING THE SILI...
- Publication number 20210371666
- Publication date Dec 2, 2021
- Shin-Etsu Chemical Co., Ltd.
- Toshio SHIOBARA
- C01 - INORGANIC CHEMISTRY

Hajime ITOKAWA

Person

Patents Grantslast 30 patents

Method for packing quartz glass cloth

Low dielectric silica powder, resin composition containing the sili...

Resin substrate having dielectric characteristics with little frequ...

Low dielectric resin substrate

Patents Applicationslast 30 patents

METHOD FOR PACKING QUARTZ GLASS CLOTH

LOW DIELECTRIC SILICA POWDER, RESIN COMPOSITION CONTAINING THE SILI...

Glass Cloth and Method of Manufacture

RESIN SUBSTRATE HAVING DIELECTRIC CHARACTERISTICS WITH LITTLE FREQU...

LOW DIELECTRIC RESIN SUBSTRATE

LOW DIELECTRIC SILICA POWDER, RESIN COMPOSITION CONTAINING THE SILI...