Hajime MITSUISHI

Person

Yokohama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate bonding apparatus and substrate bonding method
- Patent number 12,165,902
- Issue date Dec 10, 2024
- Nikon Corporation
- Hajime Mitsuishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for manufacturing stacked substrate
- Patent number 12,107,068
- Issue date Oct 1, 2024
- Nikon Corporation
- Hajime Mitsuishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stacking substrates and method for the same
- Patent number 12,100,667
- Issue date Sep 24, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method, bonding device, and holding member
- Patent number 12,080,554
- Issue date Sep 3, 2024
- Nikon Corporation
- Hajime Mitsuishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked substrate manufacturing method, stacked substrate manufactu...
- Patent number 11,842,905
- Issue date Dec 12, 2023
- Nikon Corporation
- Isao Sugaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking apparatus and stacking method
- Patent number 11,823,935
- Issue date Nov 21, 2023
- Nikon Corporation
- Hajime Mitsuishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and substrate bonding method
- Patent number 11,791,223
- Issue date Oct 17, 2023
- Nikon Corporation
- Isao Sugaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method and manufacturing apparatus for stacked substr...
- Patent number 11,362,059
- Issue date Jun 14, 2022
- Nikon Corporation
- Isao Sugaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stacking substrates and method for the same
- Patent number 11,211,338
- Issue date Dec 28, 2021
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method, bonding device, and holding member
- Patent number 11,004,686
- Issue date May 11, 2021
- Nikon Corporation
- Hajime Mitsuishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacking apparatus and stacking method
- Patent number 10,825,707
- Issue date Nov 3, 2020
- Nikon Corporation
- Hajime Mitsuishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stacking substrates and method for the same
- Patent number 10,483,212
- Issue date Nov 19, 2019
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate bonding apparatus and substrate bonding method
- Patent number 10,424,557
- Issue date Sep 24, 2019
- Nikon Corporation
- Isao Sugaya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME
- Publication number 20240413093
- Publication date Dec 12, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE CORRECTION DEVICE, SUBSTRATE LAMINATION DEVICE, SUBSTRATE...
- Publication number 20240404859
- Publication date Dec 5, 2024
- Nikon Corporation
- Mikio USHIJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR MANUFACTURING STACKED SUBSTRATE
- Publication number 20240404987
- Publication date Dec 5, 2024
- Nikon Corporation
- Hajime MITSUISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER
- Publication number 20240387177
- Publication date Nov 21, 2024
- Nikon Corporation
- Hajime MITSUISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED SUBSTRATE MANUFACTURING METHOD, STACKED SUBSTRATE MANUFACTU...
- Publication number 20240021447
- Publication date Jan 18, 2024
- Nikon Corporation
- Isao SUGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
- Publication number 20240014079
- Publication date Jan 11, 2024
- Nikon Corporation
- Isao SUGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL DEVICE, CONTROL METHOD, AND PROGRAM
- Publication number 20230052396
- Publication date Feb 16, 2023
- Nikon Corporation
- Hidehiro MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME
- Publication number 20220148978
- Publication date May 12, 2022
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
- Publication number 20220084870
- Publication date Mar 17, 2022
- Nikon Corporation
- Hajime MITSUISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING DEVICE, CALCULATION DEVICE, SUBSTRATE BONDING MET...
- Publication number 20210242044
- Publication date Aug 5, 2021
- Nikon Corporation
- Hajime MITSUISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER
- Publication number 20210225651
- Publication date Jul 22, 2021
- Nikon Corporation
- Hajime MITSUISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING METHOD AND BONDING DEVICE
- Publication number 20210138778
- Publication date May 13, 2021
- Nikon Corporation
- Yoshihiro MAEHARA
- B32 - LAYERED PRODUCTS
Information Patent Application
ALIGNMENT METHOD AND ALIGNMENT APPARATUS
- Publication number 20200381387
- Publication date Dec 3, 2020
- Nikon Corporation
- Hajime MITSUISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Bonding Apparatus and Substrate Bonding Method
- Publication number 20200335472
- Publication date Oct 22, 2020
- Nikon Corporation
- Kazuya OKAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND DEVICE FOR MANUFACTURING STACKED SUBSTRATE
- Publication number 20200286851
- Publication date Sep 10, 2020
- Nikon Corporation
- Hajime MITSUISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD AND MANUFACTURING APPARATUS FOR STACKED SUBSTR...
- Publication number 20200273836
- Publication date Aug 27, 2020
- Nikon Corporation
- Isao SUGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING METHOD, MULTILAYER SUBSTRATE MANUFACTURING METHOD...
- Publication number 20200091015
- Publication date Mar 19, 2020
- Nikon Corporation
- Isao SUGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME
- Publication number 20200043860
- Publication date Feb 6, 2020
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER
- Publication number 20190267238
- Publication date Aug 29, 2019
- Nikon Corporation
- Hajime MITSUISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED SUBSTRATE MANUFACTURING METHOD, STACKED SUBSTRATE MANUFACTU...
- Publication number 20190148184
- Publication date May 16, 2019
- Nikon Corporation
- Isao SUGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKING APPARATUS AND STACKING METHOD
- Publication number 20190122915
- Publication date Apr 25, 2019
- Nikon Corporation
- Hajime MITSUISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
- Publication number 20190043826
- Publication date Feb 7, 2019
- Nikon Corporation
- Isao SUGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
- Publication number 20180308770
- Publication date Oct 25, 2018
- Nikon Corporation
- Isao SUGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME
- Publication number 20170278803
- Publication date Sep 28, 2017
- Nikon Corporation
- Isao Sugaya
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Substrate Bonding Apparatus and Substrate Bonding Method
- Publication number 20150083786
- Publication date Mar 26, 2015
- Nikon Corporation
- Kazuya OKAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Hajime MITSUISHI

Person

Patents Grantslast 30 patents

Substrate bonding apparatus and substrate bonding method

Method and device for manufacturing stacked substrate

Apparatus for stacking substrates and method for the same

Bonding method, bonding device, and holding member

Stacked substrate manufacturing method, stacked substrate manufactu...

Stacking apparatus and stacking method

Substrate bonding apparatus and substrate bonding method

Manufacturing method and manufacturing apparatus for stacked substr...

Apparatus for stacking substrates and method for the same

Bonding method, bonding device, and holding member

Stacking apparatus and stacking method

Apparatus for stacking substrates and method for the same

Substrate bonding apparatus and substrate bonding method

Patents Applicationslast 30 patents

APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME

SUBSTRATE CORRECTION DEVICE, SUBSTRATE LAMINATION DEVICE, SUBSTRATE...

METHOD AND DEVICE FOR MANUFACTURING STACKED SUBSTRATE

BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER

STACKED SUBSTRATE MANUFACTURING METHOD, STACKED SUBSTRATE MANUFACTU...

SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

CONTROL DEVICE, CONTROL METHOD, AND PROGRAM

APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME

SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

SUBSTRATE BONDING DEVICE, CALCULATION DEVICE, SUBSTRATE BONDING MET...

BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER

BONDING METHOD AND BONDING DEVICE

ALIGNMENT METHOD AND ALIGNMENT APPARATUS

Substrate Bonding Apparatus and Substrate Bonding Method

METHOD AND DEVICE FOR MANUFACTURING STACKED SUBSTRATE

MANUFACTURING METHOD AND MANUFACTURING APPARATUS FOR STACKED SUBSTR...

SUBSTRATE BONDING METHOD, MULTILAYER SUBSTRATE MANUFACTURING METHOD...

APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME

BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER

STACKED SUBSTRATE MANUFACTURING METHOD, STACKED SUBSTRATE MANUFACTU...

STACKING APPARATUS AND STACKING METHOD

SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME

Substrate Bonding Apparatus and Substrate Bonding Method