Hajime NAKANO

Person

Hitachi-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin composition for insulating film or surface-protective film of...
- Patent number 8,765,868
- Issue date Jul 1, 2014
- Hitachi Chemical DuPont Microsystems, Ltd.
- Hajime Nakano
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Photosensitive polymer composition, method of forming relief patter...
- Patent number 8,304,149
- Issue date Nov 6, 2012
- Hitachi Chemical DuPont Microsystems Ltd.
- Masataka Nunomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Positive-type photosensitive resin composition, method for producin...
- Patent number 8,097,386
- Issue date Jan 17, 2012
- Hitachi Chemical DuPont Microsystems, Ltd.
- Hajime Nakano
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Heat-resistant photosensitive resin composition, method for forming...
- Patent number 7,932,012
- Issue date Apr 26, 2011
- Hitachi Chemical DuPont Microsystems Ltd.
- Hiroshi Komatsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive polymer composition, method of forming relief patter...
- Patent number 7,851,128
- Issue date Dec 14, 2010
- Hitachi Chemical DuPont Microsystems Ltd.
- Masataka Nunomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Positive photosensitive resin composition, method for forming patte...
- Patent number 7,638,254
- Issue date Dec 29, 2009
- Hitachi Chemical DuPont Microsystems Ltd.
- Takashi Hattori
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Positive photosensitive resin composition, method for forming patte...
- Patent number 7,435,525
- Issue date Oct 14, 2008
- Hitachi Chemical DuPont Microsystems Ltd.
- Takashi Hattori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive polymer composition, method of forming relief patter...
- Patent number 7,150,947
- Issue date Dec 19, 2006
- Hitachi Chemical DuPont Microsystems Ltd.
- Masataka Nunomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PHOTOSENSITIVE POLYMER COMPOSITION, METHOD OF FORMING RELIEF PATTER...
- Publication number 20110076458
- Publication date Mar 31, 2011
- Masataka Nunomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin composition for insulating film or surface-protective film of...
- Publication number 20110027544
- Publication date Feb 3, 2011
- Hitachi Chemical DuPont MicroSystems, Ltd.
- Hajime NAKANO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCIN...
- Publication number 20100227126
- Publication date Sep 9, 2010
- Hajime Nakano
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTE...
- Publication number 20090011364
- Publication date Jan 8, 2009
- Takashi HATTORI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Heat-Resistant Photosensitive Resin Composition, Method For Forming...
- Publication number 20080233513
- Publication date Sep 25, 2008
- Hiroshi Komatsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Positive photosensitive resin composition, method for forming patte...
- Publication number 20070122733
- Publication date May 31, 2007
- Takashi Hattori
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Photosensitive polymer composition, method of forming relief patter...
- Publication number 20070072122
- Publication date Mar 29, 2007
- Masataka Nunomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Photosensitive polymer composition, method of forming relief patter...
- Publication number 20040029045
- Publication date Feb 12, 2004
- Masataka Nunomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hajime NAKANO

Person

Patents Grantslast 30 patents

Resin composition for insulating film or surface-protective film of...

Photosensitive polymer composition, method of forming relief patter...

Positive-type photosensitive resin composition, method for producin...

Heat-resistant photosensitive resin composition, method for forming...

Photosensitive polymer composition, method of forming relief patter...

Positive photosensitive resin composition, method for forming patte...

Positive photosensitive resin composition, method for forming patte...

Photosensitive polymer composition, method of forming relief patter...

Patents Applicationslast 30 patents

PHOTOSENSITIVE POLYMER COMPOSITION, METHOD OF FORMING RELIEF PATTER...

Resin composition for insulating film or surface-protective film of...

POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCIN...

POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTE...

Heat-Resistant Photosensitive Resin Composition, Method For Forming...

Positive photosensitive resin composition, method for forming patte...

Photosensitive polymer composition, method of forming relief patter...

Photosensitive polymer composition, method of forming relief patter...