Hajime NAKAZONO

Person

Kizugawa-shi, Kyoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electroconductive coating material and method for producing shielde...
- Patent number 11,912,897
- Issue date Feb 27, 2024
- Tatsuta Electric Wire & Cable Co., Ltd.
- Hajime Nakazono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paint, method for producing shield package using the sam...
- Patent number 11,834,586
- Issue date Dec 5, 2023
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Hajime Nakazono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shield package and method of manufacturing shield package
- Patent number 11,510,349
- Issue date Nov 22, 2022
- Tatsuta Electric Wire & Cable Co., Ltd.
- Hiroaki Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shield package
- Patent number 11,191,198
- Issue date Nov 30, 2021
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Hiroaki Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste and multilayer board using the same
- Patent number 10,153,066
- Issue date Dec 11, 2018
- Tatsuta Electric Wire & Cable Co., Ltd.
- Hajime Nakazono
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMALLY CONDUCTIVE COMPOSITION
- Publication number 20240425640
- Publication date Dec 26, 2024
- Tatsuta Electric Wire & Cable Co., Ltd.
- Tsuyoshi TSUDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CONDUCTIVE COMPOSITION AND METHOD FOR PRODUCING SHIELDED PACKAGE US...
- Publication number 20230151228
- Publication date May 18, 2023
- Tatsuta Electric Wire & Cable Co., Ltd.
- Hiroaki UMEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PAINT, METHOD FOR PRODUCING SHIELD PACKAGE USING THE SAM...
- Publication number 20220251398
- Publication date Aug 11, 2022
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hajime Nakazono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shield Package and Method of Manufacturing Shield Package
- Publication number 20210076544
- Publication date Mar 11, 2021
- Tatsuta Electric Wire & Cable Co., Ltd.
- Hiroaki UMEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electroconductive Coating Material and Method for Producing Shielde...
- Publication number 20210024758
- Publication date Jan 28, 2021
- Tatsuta Electric Wire & Cable Co., Ltd.
- Hajime NAKAZONO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SHIELD PACKAGE
- Publication number 20200288608
- Publication date Sep 10, 2020
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hiroaki Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE COATING MATERIAL AND PRODUCTION METHOD FOR SHIELDED PACK...
- Publication number 20190292381
- Publication date Sep 26, 2019
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hajime Nakazono
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CONDUCTIVE PASTE AND MULTILAYER BOARD USING THE SAME
- Publication number 20170358381
- Publication date Dec 14, 2017
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hajime NAKAZONO
- C07 - ORGANIC CHEMISTRY

Hajime NAKAZONO

Person

Patents Grantslast 30 patents

Electroconductive coating material and method for producing shielde...

Conductive paint, method for producing shield package using the sam...

Shield package and method of manufacturing shield package

Shield package

Conductive paste and multilayer board using the same

Patents Applicationslast 30 patents

THERMALLY CONDUCTIVE COMPOSITION

CONDUCTIVE COMPOSITION AND METHOD FOR PRODUCING SHIELDED PACKAGE US...

CONDUCTIVE PAINT, METHOD FOR PRODUCING SHIELD PACKAGE USING THE SAM...

Shield Package and Method of Manufacturing Shield Package

Electroconductive Coating Material and Method for Producing Shielde...

SHIELD PACKAGE

CONDUCTIVE COATING MATERIAL AND PRODUCTION METHOD FOR SHIELDED PACK...

CONDUCTIVE PASTE AND MULTILAYER BOARD USING THE SAME