Hajime Saiki

Person

Nagoya-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,132,494
- Issue date Sep 15, 2015
- NGK Spark Plug Co., Ltd.
- Masahiro Inoue
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board
- Patent number 9,119,333
- Issue date Aug 25, 2015
- NGK Spark Plug Co., Ltd.
- Takuya Hando
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer wiring substrate, and multilayer...
- Patent number 9,006,580
- Issue date Apr 14, 2015
- NGK Spark Plug Co., Ltd.
- Shinnosuke Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring board for mounting electronic compo...
- Patent number 8,937,256
- Issue date Jan 20, 2015
- NGK Spark Plug Co., Ltd.
- Masahiro Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board
- Patent number 8,866,025
- Issue date Oct 21, 2014
- NGK Spark Plug Co., Ltd.
- Masahiro Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate manufacturing method
- Patent number 8,322,596
- Issue date Dec 4, 2012
- NGK Spark Plug Co., Ltd.
- Takahiro Hayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board having wiring laminate portion with via conductors emb...
- Patent number 8,319,111
- Issue date Nov 27, 2012
- NGK Spark Plug Co., Ltd.
- Hajime Saiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board having solder bump and method for manufacturing the same
- Patent number 8,143,534
- Issue date Mar 27, 2012
- NGK Spark Plug Co., Ltd.
- Takuya Hando
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 7,808,799
- Issue date Oct 5, 2010
- NGK Spark Plug Co., Ltd.
- Tadahiko Kawabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring board
- Patent number 7,704,548
- Issue date Apr 27, 2010
- NGK Spark Plug Co., Ltd.
- Tadahiko Kawabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and manufacturing process of the same
- Patent number 7,692,103
- Issue date Apr 6, 2010
- NGK Spark Plug Co., Ltd.
- Hajime Saiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board with semiconductor component
- Patent number 7,488,896
- Issue date Feb 10, 2009
- NGK Spark Plug Co., Ltd.
- Hajime Saiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 7,420,131
- Issue date Sep 2, 2008
- NGK Spark Plug Co., Ltd.
- Hajime Saiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Intermediate substrate, intermediate substrate with semiconductor e...
- Patent number 7,317,165
- Issue date Jan 8, 2008
- NGK Spark Plug Co., Ltd.
- Hajime Saiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin substrate
- Patent number 7,291,791
- Issue date Nov 6, 2007
- NGK Spark Plug Co., Ltd.
- Hajime Saiki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for manufacturing a wiring substrate
- Patent number 7,202,156
- Issue date Apr 10, 2007
- NGK Spark Plug Co., Ltd.
- Hajime Saiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board including stacked via structure
- Patent number 7,164,085
- Issue date Jan 16, 2007
- NGK Spark Plug Co., Ltd.
- Hajime Saiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and process for manufacturing the same
- Patent number 7,122,894
- Issue date Oct 17, 2006
- NGK Spark Plug Co., Ltd.
- Atsuhiko Sugimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste printing method, solder paste printing apparatus, and...
- Patent number 6,978,714
- Issue date Dec 27, 2005
- NGK Spark Plug Co., Ltd.
- Hajime Saiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Upright-pin-joined resin substrate, method of producing the substra...
- Patent number 6,960,729
- Issue date Nov 1, 2005
- NGK Spark Plug Co., Ltd.
- Noritaka Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pin standing resin-made substrate, method of making pin standing re...
- Patent number 6,660,946
- Issue date Dec 9, 2003
- NGK Spark Plug Co., Ltd.
- Hajime Saiki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pin standing resin-made substrate, method of making pin standing re...
- Patent number 6,648,211
- Issue date Nov 18, 2003
- NGK Spark Plug Co., Ltd.
- Hajime Saiki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate having pins
- Patent number 6,583,366
- Issue date Jun 24, 2003
- NGK Spark Plug Co., Ltd.
- Hajime Saiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pin solder jointed to a resin substrate, made having a predetermine...
- Patent number 6,555,757
- Issue date Apr 29, 2003
- NGK Spark Plug Co., Ltd.
- Hajime Saiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin substrate
- Patent number 6,518,518
- Issue date Feb 11, 2003
- NGK Spark Plug Co., Ltd.
- Hajime Saiki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resinous circuit board with pins improved in joining strength
- Patent number 6,376,782
- Issue date Apr 23, 2002
- NGK Spark Plug Co., Ltd.
- Kazuo Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting board for connection between base plate and mounting board
- Patent number 6,148,900
- Issue date Nov 21, 2000
- NGK Spark Plug Co., Ltd.
- Kozo Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting board
- Patent number 6,115,913
- Issue date Sep 12, 2000
- NGK Spark Plug Co., Ltd.
- Kozo Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting board with oval-shaped protrusions
- Patent number 6,080,936
- Issue date Jun 27, 2000
- NGK Spark Plug Co., Ltd.
- Kozo Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball interposer
- Patent number D423533
- Issue date Apr 25, 2000
- NGK Spark Plug Co., Ltd
- Kozo Yamasaki
- D15 - Machines not elsewhere specified

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20120211271
- Publication date Aug 23, 2012
- NGK SPARK PLUG CO., LTD.
- Takuya HANDO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20120186863
- Publication date Jul 26, 2012
- NGK SPARK PLUG CO., LTD.
- Masahiro INOUE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD FOR MOUNTING ELECTRONIC COMPO...
- Publication number 20120186857
- Publication date Jul 26, 2012
- NGK Spark Plug Co., Inc.
- Masahiro INOUE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120186864
- Publication date Jul 26, 2012
- NGK Spark Plug Co., Inc.
- Masahiro INOUE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC-COMPONENT-MOUNTED WIRING SUBSTRATE AND METHOD OF MANUFAC...
- Publication number 20120111616
- Publication date May 10, 2012
- NGK SPARK PLUG CO., LTD.
- Masahiro INOUE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE MANUFACTURING METHOD
- Publication number 20120048914
- Publication date Mar 1, 2012
- NGK SPARK PLUG CO., LTD.
- Takahiro HAYASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE MANUFACTURING METHOD
- Publication number 20120043371
- Publication date Feb 23, 2012
- NGK SPARK PLUG CO., LTD.
- Takahiro HAYASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD HAVING SOLDER BUMP AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090229861
- Publication date Sep 17, 2009
- Takuya Hando
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
WIRING BOARD
- Publication number 20080083560
- Publication date Apr 10, 2008
- NGK SPARK PLUG CO., LTD.
- Hajime Saiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20070281394
- Publication date Dec 6, 2007
- NGK SPARK PLUG CO., LTD.
- Tadahiko Kawabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20070263364
- Publication date Nov 15, 2007
- NGK SPARK PLUG CO., LTD.
- Tadahiko Kawabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board with semiconductor component
- Publication number 20060091525
- Publication date May 4, 2006
- NGK SPARK PLUG CO., LTD.
- Saiki Hajime
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wiring substrate and process for manufacturing the same
- Publication number 20050253263
- Publication date Nov 17, 2005
- NGK SPARK PLUG CO., LTD.
- Atsuhiko Sugimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin substrate
- Publication number 20050186812
- Publication date Aug 25, 2005
- NGK SPARK PLUG CO., LTD.
- Hajime Saiki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring board including stacked via structure
- Publication number 20050155791
- Publication date Jul 21, 2005
- Hajime Saiki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wiring substrate and manufacturing process of the same
- Publication number 20050103520
- Publication date May 19, 2005
- Hajime Saiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for manufacturing a wiring substrate
- Publication number 20050106854
- Publication date May 19, 2005
- Hajime Saiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for manufacturing a wiring substrate
- Publication number 20050102830
- Publication date May 19, 2005
- Hajime Saiki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Process for manufacturing a wiring substrate
- Publication number 20050102831
- Publication date May 19, 2005
- Hajime Saiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Intermediate substrate, intermediate substrate with semiconductor e...
- Publication number 20050023033
- Publication date Feb 3, 2005
- NGK SPARK PLUG CO., LTD.
- Hajime Saiki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wiring substrate
- Publication number 20040182265
- Publication date Sep 23, 2004
- NGK SPARK PLUG CO., LTD.
- Hajime Saiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring substrate
- Publication number 20040177999
- Publication date Sep 16, 2004
- NGK SPARK PLUG CO., LTD.
- Hajime Saiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder paste printing method, solder paste printing apparatus, and...
- Publication number 20040134363
- Publication date Jul 15, 2004
- NGK SPARK PLUG CO., LTD.
- Hajime Saiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin substrate
- Publication number 20030089524
- Publication date May 15, 2003
- NGK SPARK PLUG CO., LTD.
- Hajime Saiki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Upright-pin-joined resin substrate, method of producing the substra...
- Publication number 20030027463
- Publication date Feb 6, 2003
- NGK SPARK PLUG CO., LTD.
- Noritaka Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pin standing resin-made substrate, method of making pin standing re...
- Publication number 20020096361
- Publication date Jul 25, 2002
- Hajime Saiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pin standing resin-made substrate, method of making pin standing re...
- Publication number 20020088844
- Publication date Jul 11, 2002
- NGK SPARK PLUG CO., LTD.
- Hajime Saiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pin standing resin-made substrate, method of making pin standing re...
- Publication number 20020004324
- Publication date Jan 10, 2002
- Hajime Saiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate having pins
- Publication number 20010046796
- Publication date Nov 29, 2001
- Hajime Saiki
- H01 - BASIC ELECTRIC ELEMENTS

Hajime Saiki

Person

Patents Grantslast 30 patents

Wiring board and method for manufacturing the same

Multilayer wiring board

Method of manufacturing multilayer wiring substrate, and multilayer...

Method for manufacturing wiring board for mounting electronic compo...

Multilayer wiring board

Wiring substrate manufacturing method

Wiring board having wiring laminate portion with via conductors emb...

Wiring board having solder bump and method for manufacturing the same

Wiring board

Method for manufacturing wiring board

Wiring substrate and manufacturing process of the same

Wiring board with semiconductor component

Wiring substrate

Intermediate substrate, intermediate substrate with semiconductor e...

Resin substrate

Process for manufacturing a wiring substrate

Multilayer wiring board including stacked via structure

Wiring substrate and process for manufacturing the same

Solder paste printing method, solder paste printing apparatus, and...

Upright-pin-joined resin substrate, method of producing the substra...

Pin standing resin-made substrate, method of making pin standing re...

Pin standing resin-made substrate, method of making pin standing re...

Substrate having pins

Pin solder jointed to a resin substrate, made having a predetermine...

Resin substrate

Resinous circuit board with pins improved in joining strength

Connecting board for connection between base plate and mounting board

Connecting board

Connecting board with oval-shaped protrusions

Solder ball interposer

Patents Applicationslast 30 patents

MULTILAYER WIRING BOARD

MULTILAYER WIRING BOARD

METHOD FOR MANUFACTURING WIRING BOARD FOR MOUNTING ELECTRONIC COMPO...

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC-COMPONENT-MOUNTED WIRING SUBSTRATE AND METHOD OF MANUFAC...

WIRING SUBSTRATE MANUFACTURING METHOD

WIRING SUBSTRATE MANUFACTURING METHOD

WIRING BOARD HAVING SOLDER BUMP AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD

METHOD FOR MANUFACTURING WIRING BOARD

WIRING BOARD

Wiring board with semiconductor component

Wiring substrate and process for manufacturing the same

Resin substrate

Multilayer wiring board including stacked via structure

Wiring substrate and manufacturing process of the same

Process for manufacturing a wiring substrate

Process for manufacturing a wiring substrate

Process for manufacturing a wiring substrate

Intermediate substrate, intermediate substrate with semiconductor e...

Wiring substrate

Wiring substrate

Solder paste printing method, solder paste printing apparatus, and...

Resin substrate

Upright-pin-joined resin substrate, method of producing the substra...

Pin standing resin-made substrate, method of making pin standing re...

Pin standing resin-made substrate, method of making pin standing re...

Pin standing resin-made substrate, method of making pin standing re...

Substrate having pins