Hajime Wada

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Sunnyvale, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
System and method for gate formation in a semiconductor device
- Patent number 7,320,914
- Issue date Jan 22, 2008
- Spansion LLC
- Hajime Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for copper metallization having increased reliab...
- Patent number 7,242,102
- Issue date Jul 10, 2007
- Spansion LLC
- Inkuk Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for gate formation in a semiconductor device
- Patent number 7,220,643
- Issue date May 22, 2007
- Spansion LLC
- Hajime Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for protecting memory cells from UV radiation...
- Patent number 6,974,989
- Issue date Dec 13, 2005
- Spansion LLC
- Cinti X. Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Bond pad structure for copper metallization having increased reliab...
- Publication number 20060006552
- Publication date Jan 12, 2006
- FASL, LLC.
- Inkuk Kang
- H01 - BASIC ELECTRIC ELEMENTS