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Adhesive of epoxy resin, CTBN and maleimide
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Patent number 5,292,812
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Issue date Mar 8, 1994
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The Yokohama Rubber Co., Ltd.
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Hajime Yamazaki
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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Printed wiring board
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Patent number 4,985,294
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Issue date Jan 15, 1991
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The Yokohama Rubber Co., Ltd.
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Hideo Watanabe
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B32 - LAYERED PRODUCTS
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Adhesive compositions
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Patent number 4,654,382
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Issue date Mar 31, 1987
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The Yokohama Rubber Co., Ltd.
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Misao Hiza
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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Epoxy resin composition
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Patent number 4,632,970
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Issue date Dec 30, 1986
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The Yokohama Rubber Co., Ltd.
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Misao Hiza
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...