Hajime Yamazaki

Person

  • Hadano, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Adhesive of epoxy resin, CTBN and maleimide

    • Patent number 5,292,812
    • Issue date Mar 8, 1994
    • The Yokohama Rubber Co., Ltd.
    • Hajime Yamazaki
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Process for producing printed wiring boards

    • Patent number 5,153,987
    • Issue date Oct 13, 1992
    • Hitachi Chemical Company, Ltd.
    • Hiroshi Takahashi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed wiring board

    • Patent number 4,985,294
    • Issue date Jan 15, 1991
    • The Yokohama Rubber Co., Ltd.
    • Hideo Watanabe
    • B32 - LAYERED PRODUCTS
  • Information Patent Grant

    Microwave-absorptive composite

    • Patent number 4,960,633
    • Issue date Oct 2, 1990
    • The Yokohama Rubber Co., Ltd.
    • Misao Hiza
    • B32 - LAYERED PRODUCTS
  • Information Patent Grant

    Multi-layered microwave absorber and method of manufacturing the same

    • Patent number 4,923,736
    • Issue date May 8, 1990
    • The Yokohama Rubber Co., Ltd.
    • Misao Hiza
    • B32 - LAYERED PRODUCTS
  • Information Patent Grant

    Adhesive compositions

    • Patent number 4,654,382
    • Issue date Mar 31, 1987
    • The Yokohama Rubber Co., Ltd.
    • Misao Hiza
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Epoxy resin composition

    • Patent number 4,632,970
    • Issue date Dec 30, 1986
    • The Yokohama Rubber Co., Ltd.
    • Misao Hiza
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...