Hajime Yazu

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Ogaki-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Conductive pin attached to package substrate
- Patent number 8,536,696
- Issue date Sep 17, 2013
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate with a conductive connecting pin
- Patent number 8,110,917
- Issue date Feb 7, 2012
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive connecting pin for package substance
- Patent number 8,035,214
- Issue date Oct 11, 2011
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive connecting pin and package substrate
- Patent number 7,902,659
- Issue date Mar 8, 2011
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive connecting pins for a package substrate
- Patent number 7,847,393
- Issue date Dec 7, 2010
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part mounting board and method of manufacturing the same
- Patent number 5,124,884
- Issue date Jun 23, 1992
- Ibiden Co., Ltd.
- Hajime Yazu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE
- Publication number 20100032200
- Publication date Feb 11, 2010
- IBIDEN CO., LTD.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE
- Publication number 20090314537
- Publication date Dec 24, 2009
- IBIDEN CO., LTD.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE
- Publication number 20090154131
- Publication date Jun 18, 2009
- IBIDEN CO., LTD.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE
- Publication number 20090053459
- Publication date Feb 26, 2009
- IBIDEN CO., LTD.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR