Hakjun LEE

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Suwon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Substrate bonding apparatus and method of manufacturing semiconduct...
- Patent number 11,594,443
- Issue date Feb 28, 2023
- Samsung Electronics Co., Ltd.
- Hoechul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus
- Patent number 10,923,452
- Issue date Feb 16, 2021
- Samsung Electronics Co., Ltd.
- Ilyoung Han
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20210057263
- Publication date Feb 25, 2021
- Samsung Electronics Co., Ltd.
- Hoechul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS
- Publication number 20200373274
- Publication date Nov 26, 2020
- Samsung Electronics Co., Ltd.
- Ilyoung HAN
- H01 - BASIC ELECTRIC ELEMENTS