Hakseung LEE

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices having penetration vias
- Patent number 12,347,781
- Issue date Jul 1, 2025
- Samsung Electronics Co., Ltd.
- Hakseung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,804,419
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Hakseung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for etching substrate bevel and semiconductor fabrication...
- Patent number 11,791,137
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Hakseung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor stack and method for manufacturing the same
- Patent number 11,694,980
- Issue date Jul 4, 2023
- Samsung Electronics Co., Ltd.
- Hyungjun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having penetration vias with portions having...
- Patent number 11,664,316
- Issue date May 30, 2023
- Samsung Electronics Co., Ltd.
- Hakseung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including via structure with head and body por...
- Patent number 11,380,606
- Issue date Jul 5, 2022
- Samsung Electronics Co., Ltd.
- Eunji Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including through holes and methods of fabri...
- Patent number 11,373,932
- Issue date Jun 28, 2022
- Samsung Electronics Co., Ltd.
- Hyoukyung Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor stack and method for manufacturing the same
- Patent number 11,315,894
- Issue date Apr 26, 2022
- Samsung Electronics Co., Ltd.
- Hyungjun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 11,133,240
- Issue date Sep 28, 2021
- Samsung Electronics Co., Ltd.
- Hakseung Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES HAVING PENETRATION VIAS
- Publication number 20230260916
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- Hakseung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20220336327
- Publication date Oct 20, 2022
- Samsung Electronics Co., Ltd.
- EUNJI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STACK AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220223555
- Publication date Jul 14, 2022
- Samsung Electronics Co., Ltd.
- Hyungjun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220037235
- Publication date Feb 3, 2022
- Samsung Electronics Co., Ltd.
- Hakseung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STACK AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210305186
- Publication date Sep 30, 2021
- Samsung Electronics Co., Ltd.
- Hyungjun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR ETCHING SUBSTRATE BEVEL AND SEMICONDUCTOR FABRICATION...
- Publication number 20210066386
- Publication date Mar 4, 2021
- Samsung Electronics Co., Ltd.
- Hakseung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING PENETRATION VIAS
- Publication number 20210043575
- Publication date Feb 11, 2021
- Samsung Electronics Co., Ltd.
- Hakseung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20210020543
- Publication date Jan 21, 2021
- Samsung Electronics Co., Ltd.
- Hakseung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20210020545
- Publication date Jan 21, 2021
- Samsung Electronics Co., Ltd.
- EUNJI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING THROUGH HOLES AND METHODS OF FABRI...
- Publication number 20210005533
- Publication date Jan 7, 2021
- Samsung Electronics Co., Ltd.
- Hyoukyung Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200066682
- Publication date Feb 27, 2020
- Samsung Electronics Co., Ltd.
- Taeseong KIM
- H01 - BASIC ELECTRIC ELEMENTS

Hakseung LEE

Person

Patents Grantslast 30 patents

Semiconductor devices having penetration vias

Semiconductor device

Apparatus for etching substrate bevel and semiconductor fabrication...

Semiconductor stack and method for manufacturing the same

Semiconductor devices having penetration vias with portions having...

Semiconductor device including via structure with head and body por...

Semiconductor packages including through holes and methods of fabri...

Semiconductor stack and method for manufacturing the same

Semiconductor device and semiconductor package

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES HAVING PENETRATION VIAS

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STACK AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STACK AND METHOD FOR MANUFACTURING THE SAME

APPARATUS FOR ETCHING SUBSTRATE BEVEL AND SEMICONDUCTOR FABRICATION...

SEMICONDUCTOR DEVICES HAVING PENETRATION VIAS

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES INCLUDING THROUGH HOLES AND METHODS OF FABRI...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME