Haksun LEE

Person

Daejeon, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding structure of electronic equipment
- Patent number 9,538,666
- Issue date Jan 3, 2017
- Electronics and Telecommunications Research Institute
- Kwang-Seong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming bump and semiconductor device with the same
- Patent number 9,006,037
- Issue date Apr 14, 2015
- Electronics and Telecommunications Research Institute
- Kwang-Seong Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
- Publication number 20170141071
- Publication date May 18, 2017
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Kwang-Seong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160358892
- Publication date Dec 8, 2016
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Haksun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSCEIVER MODULE AND COMMUNICATION APPARATUS INCLUDING THE SAME
- Publication number 20160094258
- Publication date Mar 31, 2016
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Hyun-cheol BAE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
STACK MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150364445
- Publication date Dec 17, 2015
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Kwang Seong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150228617
- Publication date Aug 13, 2015
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Haksun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF ELECTRONIC EQUIPMENT
- Publication number 20150043175
- Publication date Feb 12, 2015
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- KWANG-SEONG CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING A SOLDER PARTICLE
- Publication number 20140367375
- Publication date Dec 18, 2014
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Hyun-cheol BAE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FORMING BUMP AND SEMICONDUCTOR DEVICE WITH THE SAME
- Publication number 20140287556
- Publication date Sep 25, 2014
- Kwang-Seong CHOI
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Bonding structure of electronic equipment

Methods of forming bump and semiconductor device with the same

Patents Applicationslast 30 patents

METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

TRANSCEIVER MODULE AND COMMUNICATION APPARATUS INCLUDING THE SAME

STACK MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

BONDING STRUCTURE OF ELECTRONIC EQUIPMENT

METHOD OF FABRICATING A SOLDER PARTICLE

METHODS OF FORMING BUMP AND SEMICONDUCTOR DEVICE WITH THE SAME