HALE JOHNSON

Person

JERICHO, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 11,651,983
- Issue date May 16, 2023
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and related techniques for handling aligned substrate pairs
- Patent number 11,183,401
- Issue date Nov 23, 2021
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 10,825,705
- Issue date Nov 3, 2020
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for semiconductor wafer leveling, force balanc...
- Patent number 10,580,678
- Issue date Mar 3, 2020
- Suss Microtec Lithography, GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding apparatus and related techniques
- Patent number 10,319,615
- Issue date Jun 11, 2019
- Suss MicroTec Lithography GmbH
- Gregory George
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Semiconductor bonding apparatus and related techniques
- Patent number 9,875,917
- Issue date Jan 23, 2018
- SUSS MicroTech Lithography GmbH
- Gregory George
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Apparatus and method for aligning and centering wafers
- Patent number 9,859,141
- Issue date Jan 2, 2018
- SUSS MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for semiconductor wafer leveling, force balanc...
- Patent number 9,837,295
- Issue date Dec 5, 2017
- SUSS MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 9,640,418
- Issue date May 2, 2017
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for thermal-slide debonding of temporary bonded semiconducto...
- Patent number 9,281,229
- Issue date Mar 8, 2016
- Suss MicroTec Lithography GmbH
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus for thermal-slide debonding of temporary bonded semicondu...
- Patent number 8,919,412
- Issue date Dec 30, 2014
- Suss Microtec Lithography, GmbH
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Grant
Device for centering wafers
- Patent number 8,764,026
- Issue date Jul 1, 2014
- Suss Microtec Lithography, GmbH
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus for mechanically debonding temporary bonded semiconductor...
- Patent number 8,267,143
- Issue date Sep 18, 2012
- Suss Microtec Lithography, GmbH
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus for temporary wafer bonding and debonding
- Patent number 8,181,688
- Issue date May 22, 2012
- Suss Microtec Lithography, GmbH
- Hale Johnson
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus and method for semiconductor wafer bumping via injection...
- Patent number 8,088,684
- Issue date Jan 3, 2012
- Suss Microtec AG
- Hale Johnson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for semiconductor wafer bumping via injection...
- Patent number 7,790,596
- Issue date Sep 7, 2010
- Suss Microtec AG
- Hale Johnson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for semiconductor wafer bumping via injection...
- Patent number 7,732,320
- Issue date Jun 8, 2010
- Suss Microtec AG
- Hale Johnson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nanoimprinting apparatus and method
- Patent number 6,829,988
- Issue date Dec 14, 2004
- Suss MicroTec, Inc.
- Gregory A. George
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS
- Publication number 20210013079
- Publication date Jan 14, 2021
- SUSS MICROTEC LITHOGRAPHY GMBH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Bonding Apparatus and Related Techniques
- Publication number 20180108547
- Publication date Apr 19, 2018
- SUSS MICROTEC LITHOGRAPHY GMBH
- Gregory George
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Apparatus and Method for Semiconductor Wafer Leveling, Force Balanc...
- Publication number 20180102270
- Publication date Apr 12, 2018
- SUSS MICROTEC LITHOGRAPHY, GMBH
- HALE JOHNSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND RELATED TECHNIQUES FOR HANDLING ALIGNED SUBSTRATE PAIRS
- Publication number 20170372925
- Publication date Dec 28, 2017
- SUSS MICROTEC LITHOGRAPHY GMBH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Bonding Apparatus and Related Techniques
- Publication number 20170243769
- Publication date Aug 24, 2017
- SUSS MICROTEC LITHOGRAPHY GMBH
- Gregory George
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS
- Publication number 20160336212
- Publication date Nov 17, 2016
- SUSS MICROTEC LITHOGRAPHY GMBH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS
- Publication number 20160336208
- Publication date Nov 17, 2016
- SUSS MICROTEC LITHOGRAPHY GMBH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AMD METHOD FOR SUBSTRATE HOLDING
- Publication number 20150206783
- Publication date Jul 23, 2015
- SUSS MICROTEC LITHOGRAPHY, GMBH
- HALE JOHNSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR THERMAL-SLIDE DEBONDING OF TEMPORARY BONDED SEMICONDUCTO...
- Publication number 20150083342
- Publication date Mar 26, 2015
- SUSS MICROTEC LITHOGRAPHY, GMBH
- GREGORY GEORGE
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS AND METHOD FOR ALIGNING AND CENTERING WAFERS
- Publication number 20140319786
- Publication date Oct 30, 2014
- SUSS MICROTEC LITHOGRAPHY, GMBH
- HALE JOHNSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR SEMICONDUCTOR WAFER LEVELING, FORCE BALANC...
- Publication number 20140318683
- Publication date Oct 30, 2014
- HALE JOHNSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR THERMAL-SLIDE DEBONDING OF TEMPORARY BONDED SEMICONDU...
- Publication number 20110010908
- Publication date Jan 20, 2011
- SUSS MICROTEC INC
- GREGORY GEORGE
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS FOR TEMPORARY WAFER BONDING AND DEBONDING
- Publication number 20110014774
- Publication date Jan 20, 2011
- SUSS MICROTEC INC
- HALE JOHNSON
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS FOR MECHANICALLY DEBONDING TEMPORARY BONDED SEMICONDUCTOR...
- Publication number 20100263794
- Publication date Oct 21, 2010
- SUSS MICROTEC INC
- GREGORY GEORGE
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE FOR CENTERING WAFERS
- Publication number 20100266373
- Publication date Oct 21, 2010
- SUSS MICROTEC INC
- GREGORY GEORGE
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD AND APPARATUS FOR WAFER BONDING
- Publication number 20100089978
- Publication date Apr 15, 2010
- SUSS MICROTEC INC
- EMMETT HUGHLETT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR SEMICONDUCTOR WAFER BUMPING VIA INJECTION...
- Publication number 20080188069
- Publication date Aug 7, 2008
- SUSS MICROTEC AG
- Hale Johnson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR SEMICONDUCTOR WAFER BUMPING VIA INJECTION...
- Publication number 20080188072
- Publication date Aug 7, 2008
- SUSS MICROTEC AG
- Hale Johnson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR SEMICONDUCTOR WAFER BUMPING VIA INJECTION...
- Publication number 20080188070
- Publication date Aug 7, 2008
- SUSS MICROTEC AG
- HALE JOHNSON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NANOIMPRINTING APPARATUS AND METHOD
- Publication number 20040226460
- Publication date Nov 18, 2004
- Gregory A. George
- B82 - NANO-TECHNOLOGY

HALE JOHNSON

Person

Patents Grantslast 30 patents

Apparatus, system, and method for handling aligned wafer pairs

System and related techniques for handling aligned substrate pairs

Apparatus, system, and method for handling aligned wafer pairs

Apparatus and method for semiconductor wafer leveling, force balanc...

Semiconductor bonding apparatus and related techniques

Semiconductor bonding apparatus and related techniques

Apparatus and method for aligning and centering wafers

Apparatus and method for semiconductor wafer leveling, force balanc...

Apparatus, system, and method for handling aligned wafer pairs

Method for thermal-slide debonding of temporary bonded semiconducto...

Apparatus for thermal-slide debonding of temporary bonded semicondu...

Device for centering wafers

Apparatus for mechanically debonding temporary bonded semiconductor...

Apparatus for temporary wafer bonding and debonding

Apparatus and method for semiconductor wafer bumping via injection...

Apparatus and method for semiconductor wafer bumping via injection...

Apparatus and method for semiconductor wafer bumping via injection...

Nanoimprinting apparatus and method

Patents Applicationslast 30 patents

APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS

Semiconductor Bonding Apparatus and Related Techniques

Apparatus and Method for Semiconductor Wafer Leveling, Force Balanc...

SYSTEM AND RELATED TECHNIQUES FOR HANDLING ALIGNED SUBSTRATE PAIRS

Semiconductor Bonding Apparatus and Related Techniques

APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS

APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS

SYSTEM AMD METHOD FOR SUBSTRATE HOLDING

METHOD FOR THERMAL-SLIDE DEBONDING OF TEMPORARY BONDED SEMICONDUCTO...

APPARATUS AND METHOD FOR ALIGNING AND CENTERING WAFERS

APPARATUS AND METHOD FOR SEMICONDUCTOR WAFER LEVELING, FORCE BALANC...

APPARATUS FOR THERMAL-SLIDE DEBONDING OF TEMPORARY BONDED SEMICONDU...

APPARATUS FOR TEMPORARY WAFER BONDING AND DEBONDING

APPARATUS FOR MECHANICALLY DEBONDING TEMPORARY BONDED SEMICONDUCTOR...

DEVICE FOR CENTERING WAFERS

METHOD AND APPARATUS FOR WAFER BONDING

APPARATUS AND METHOD FOR SEMICONDUCTOR WAFER BUMPING VIA INJECTION...

APPARATUS AND METHOD FOR SEMICONDUCTOR WAFER BUMPING VIA INJECTION...

APPARATUS AND METHOD FOR SEMICONDUCTOR WAFER BUMPING VIA INJECTION...

NANOIMPRINTING APPARATUS AND METHOD