Hamdan Hamid

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Selangor, MY

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Patents Grantslast 30 patents

Information Patent Grant
Die eject assembly for die bonder
- Patent number 9,305,812
- Issue date Apr 5, 2016
- Texas Instruments Incorporated
- Ali Imran Amin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
DIE EJECT ASSEMBLY FOR DIE BONDER
- Publication number 20140251760
- Publication date Sep 11, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Ali Imran Amin
- H01 - BASIC ELECTRIC ELEMENTS