Hamdan Ismail

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Seremban, MY

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Patents Grantslast 30 patents

Information Patent Grant
Overmolded microelectronic packages containing knurled flanges and...
- Patent number 12,087,671
- Issue date Sep 10, 2024
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overmolded microelectronic packages containing knurled flanges and...
- Patent number 10,998,255
- Issue date May 4, 2021
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with isolation wall
- Patent number 9,607,953
- Issue date Mar 28, 2017
- NXP USA, INC.
- Lu Li
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
OVERMOLDED MICROELECTRONIC PACKAGES CONTAINING KNURLED FLANGES AND...
- Publication number 20210217685
- Publication date Jul 15, 2021
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERMOLDED MICROELECTRONIC PACKAGES CONTAINING KNURLED FLANGES AND...
- Publication number 20200020614
- Publication date Jan 16, 2020
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS