HAN-CHIANG HUANG

Person

TAOYUAN COUNTY, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Touch member and method of manufacturing the same
- Patent number 9,320,143
- Issue date Apr 19, 2016
- Unimicron Technology Corp.
- Cheng-Ming Weng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for multi-layer circuit board
- Patent number 9,288,917
- Issue date Mar 15, 2016
- Unimicron Technology Corp.
- Pei-Chang Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for multi-layer circuit board
- Patent number 9,198,303
- Issue date Nov 24, 2015
- Unimicron Technology Corp.
- Pei-Chang Huang
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Manufacturing method for multi-layer circuit board
- Patent number 9,095,083
- Issue date Jul 28, 2015
- Unimicron Technology Corp.
- Pei-Chang Huang
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Dianhydride monomer having side chain, polyimide compound having si...
- Patent number 9,074,051
- Issue date Jul 7, 2015
- Unimicron Technology Corp.
- Han-Pei Huang
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Polyimide compound having side chain and manufacturing method thereof
- Patent number 9,045,597
- Issue date Jun 2, 2015
- Unimicron Technology Corp.
- Han-Pei Huang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of fabricating circuit board structure
- Patent number 8,436,254
- Issue date May 7, 2013
- Unimicron Technology Corp.
- Cheng-Po Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer three-dimensional circuit structure and manufacturing me...
- Patent number 7,987,589
- Issue date Aug 2, 2011
- Unimicron Technology Corp.
- Han-Pei Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package carrier and fabrication method thereof
- Patent number 7,700,986
- Issue date Apr 20, 2010
- Unimicron Technology Corp.
- Han-Pei Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PROVIDING AUXILIARY INFORMATION AND TOUCH CONTROL DISPLA...
- Publication number 20160004373
- Publication date Jan 7, 2016
- UNIMICRON TECHNOLOGY CORP.
- HAN-PEI HUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MANUFACTURING METHOD OF DIAMINE MONOMER WITH SIDE CHAIN
- Publication number 20150266806
- Publication date Sep 24, 2015
- Unimicron Technology Corp.
- HAN-PEI HUANG
- C07 - ORGANIC CHEMISTRY
Information Patent Application
MANUFACTURING METHOD FOR MULTI-LAYER CIRCUIT BOARD
- Publication number 20150121694
- Publication date May 7, 2015
- Unimicron Technology Corp.
- Pei-Chang Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD FOR MULTI-LAYER CIRCUIT BOARD
- Publication number 20150125625
- Publication date May 7, 2015
- Unimicron Technology Corp.
- Pei-Chang Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD FOR MULTI-LAYER CIRCUIT BOARD
- Publication number 20150121693
- Publication date May 7, 2015
- Unimicron Technology Corp.
- Pei-Chang Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIAMINE MONOMER HAVING SIDE CHAIN, POLYIMIDE COMPOUND HAVING SIDE C...
- Publication number 20140275440
- Publication date Sep 18, 2014
- UNIMICRON TECHNOLOGY CORP.
- HAN-PEI HUANG
- C07 - ORGANIC CHEMISTRY
Information Patent Application
DIANHYDRIDE MONOMER HAVING SIDE CHAIN, POLYIMIDE COMPOUND HAVING SI...
- Publication number 20140275470
- Publication date Sep 18, 2014
- UNIMICRON TECHNOLOGY CORP.
- HAN-PEI HUANG
- C07 - ORGANIC CHEMISTRY
Information Patent Application
POLYIMIDE COMPOUND HAVING SIDE CHAIN AND MANUFACTURING METHOD THEREOF
- Publication number 20140275441
- Publication date Sep 18, 2014
- UNIMICRON TECHNOLOGY CORP.
- HAN-PEI HUANG
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20140174791
- Publication date Jun 26, 2014
- Unimicron Technology Corp.
- Cheng-Po Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOUCH MEMBER AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140151107
- Publication date Jun 5, 2014
- UNIMICRON TECHNOLOGY CORP.
- CHENG-MING WENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND LASER DRILLING METHOD THEREOF
- Publication number 20140151099
- Publication date Jun 5, 2014
- UNIMICRON TECHNOLOGY CORP.
- CHENG MING WENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carrier and Method for Fabricating Thereof
- Publication number 20120255770
- Publication date Oct 11, 2012
- Han-Pei Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FABRICATING CIRCUIT BOARD STRUCTURE
- Publication number 20120060368
- Publication date Mar 15, 2012
- Cheng-Po Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER THREE-DIMENSIONAL CIRCUIT STRUCTURE
- Publication number 20110253435
- Publication date Oct 20, 2011
- Unimicron Technology Corp.
- Han-Pei Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER THREE-DIMENSIONAL CIRCUIT STRUCTURE AND MANUFACTURING ME...
- Publication number 20100089627
- Publication date Apr 15, 2010
- Unimicron Technology Corp.
- Han-Pei Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE CARRIER AND FABRICATION METHOD THEREOF
- Publication number 20100013068
- Publication date Jan 21, 2010
- Unimicron Technology Corp.
- Han-Pei Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE
- Publication number 20100006327
- Publication date Jan 14, 2010
- Cheng-Po Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RECOGNITION METHOD FOR IMAGES BY PROBING ALIMENTARY CANALS
- Publication number 20090080768
- Publication date Mar 26, 2009
- CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY, ARMAMENTS BUREAU, M.N.D.
- SHAOU-GANG MIAOU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
System and method for registering information relative to communica...
- Publication number 20050255876
- Publication date Nov 17, 2005
- Benq Corporation
- Han-Chou Huang
- G06 - COMPUTING CALCULATING COUNTING

HAN-CHIANG HUANG

Person

Patents Grantslast 30 patents

Touch member and method of manufacturing the same

Manufacturing method for multi-layer circuit board

Manufacturing method for multi-layer circuit board

Manufacturing method for multi-layer circuit board

Dianhydride monomer having side chain, polyimide compound having si...

Polyimide compound having side chain and manufacturing method thereof

Method of fabricating circuit board structure

Multilayer three-dimensional circuit structure and manufacturing me...

Chip package carrier and fabrication method thereof

Patents Applicationslast 30 patents

METHOD FOR PROVIDING AUXILIARY INFORMATION AND TOUCH CONTROL DISPLA...

MANUFACTURING METHOD OF DIAMINE MONOMER WITH SIDE CHAIN

MANUFACTURING METHOD FOR MULTI-LAYER CIRCUIT BOARD

MANUFACTURING METHOD FOR MULTI-LAYER CIRCUIT BOARD

MANUFACTURING METHOD FOR MULTI-LAYER CIRCUIT BOARD

DIAMINE MONOMER HAVING SIDE CHAIN, POLYIMIDE COMPOUND HAVING SIDE C...

DIANHYDRIDE MONOMER HAVING SIDE CHAIN, POLYIMIDE COMPOUND HAVING SI...

POLYIMIDE COMPOUND HAVING SIDE CHAIN AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

TOUCH MEMBER AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD AND LASER DRILLING METHOD THEREOF

Carrier and Method for Fabricating Thereof

METHOD OF FABRICATING CIRCUIT BOARD STRUCTURE

MULTILAYER THREE-DIMENSIONAL CIRCUIT STRUCTURE

MULTILAYER THREE-DIMENSIONAL CIRCUIT STRUCTURE AND MANUFACTURING ME...

CHIP PACKAGE CARRIER AND FABRICATION METHOD THEREOF

CIRCUIT BOARD STRUCTURE

RECOGNITION METHOD FOR IMAGES BY PROBING ALIMENTARY CANALS

System and method for registering information relative to communica...