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3D FERROELECTRIC MEMORY
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Publication number 20250089264
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Publication date Mar 13, 2025
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Sheng-Chen Wang
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AIR GAPS IN MEMORY ARRAY STRUCTURES
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Publication number 20240404875
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Publication date Dec 5, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Sheng-Chen Wang
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR CHIP
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Publication number 20240389351
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Publication date Nov 21, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Bo-Feng Young
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H01 - BASIC ELECTRIC ELEMENTS
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MEMORY DEVICES
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Publication number 20240389337
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Publication date Nov 21, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Meng-Han Lin
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H01 - BASIC ELECTRIC ELEMENTS
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THREE-DIMENSIONAL MEMORY DEVICES
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Publication number 20240381656
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Publication date Nov 14, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Han-Jong Chia
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G11 - INFORMATION STORAGE
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METHOD OF FORMING MEMORY DEVICE
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Publication number 20240357826
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Publication date Oct 24, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Chao-I Wu
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H01 - BASIC ELECTRIC ELEMENTS
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3D MEMORY ARRAY CONTACT STRUCTURES
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Publication number 20240276726
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Publication date Aug 15, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Meng-Han Lin
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G11 - INFORMATION STORAGE
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Memory Array Word Line Routing
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Publication number 20240274160
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Publication date Aug 15, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Meng-Han Lin
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G11 - INFORMATION STORAGE
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